Split fabrication, the process of splitting an IC into an untrusted and trusted tier, facilitates
access to the most advanced semiconductor manufacturing capabilities available in the …

Efficiency and manufacturability of standard cell logic is critical for an IC, as standard cells
are at the heart of the nexus between technology definition, circuit design and physical …

Escalating manufacturing cost and complexity is challenging the premise of affordable
scaling. With lithography accounting for a large fraction of wafer costs, researchers are …

For the past four decades, cost and features have driven complementary metal-oxide
semiconductor (CMOS) scaling. Severe lithography and material limitations seen below the …

Routing closure and design-for-manufacturability (DFM) challenges exacerbate
nonrecurring engineering (NRE) costs, a steep barrier to entry for advanced sub-20-nm …

Theneedfor 3-Dimensional multiple-gate “MOSFETs”, such as “FinFETs”, has risen in recent
years. FinFET is a Double Gated (DG) MOS device that provides good performance since it …

Integrated circuits (ICs) are ubiquitous, ranging from consumer electronics to custom
hardware. While scaling of CMOS feature sizes has enabled faster and smaller ICs …

As the fraction of integrated circuit area dedicated to embedded memory continues to
increase, the energy spent for transporting data on-chip becomes increasingly larger than …