摘要为了减小半导体激光器列阵在封装过程中引入热应力而产生的smile 效应,
提高半导体激光器列阵光束质量, 利用对半导体激光器列阵发光点成像放大的方法 …

Thermomechanical behavior has an important effect on reliability and lifetime of high-power
diode lasers (HPDLs). Finite-element analysis (FEA) model and analytical solution model of …

二极管激光线阵封装中产生的“smile” 现象对激光器的激射特性, 寿命, 光束质量等都会产生较大
的影响. 采用高分辨率CCD, 快轴准直透镜及柱面透镜组成的单轴放大系统对激光线阵发光单元 …

摘要院为克服传统光学方法测量半导体激光阵列(LDA) Smile 效应时存在的光学系统搭建精度
要求高, 测试人员素质要求高, 后期数据处理繁杂测量时间长等缺点, 通过用机械接触式台阶仪的 …

摘要采用外建激光谐振腔, 在低于原芯片阈值的电流激励下对LDA 的每个发光点进行单独测量,
从而分析整个半导体激光阵列(LDA) 的smile 效应. 实验中利用镀膜反射率大于半导体前腔面的 …

Near-field bending of a laser diode bar (ie, the SMILE effect) degrades the laser beam
brightness, adversely affecting optical coupling and beam shaping. Previous reports mainly …

Compared to zig-zag solid-state slab lasers, zig-zag solid-state tube lasers (SSZTLs) exhibit
significant potential in beam quality improvement and output power enhancement. However …

The smile effect is caused by the thermal stress in the packaging process. If packaging
technology of a diode laser array is poor, smile effect will be very bad and the smile effect …

We study imaging systems designed to assess the smile of laser diode bars (LDBs). The
magnification matrix is derived from the required sampling period and the geometries of the …

High power semiconductor laser is a compact and precision optoelectronic device
manufactured by a series of complicated fabrication processes. The performances of a …