Requirements for the miniaturization of electronics are constantly increasing as more and
more functions are aimed to be integrated into a single device. At the same time, there are …

An integrated circuit chip attachment in a microstructure device is accomplished through the
use of an adhesive-based material in which graphene flakes are incorporated. This results …

A die assembly is disclosed. The die assembly includes a die, one or more die pads on a
first surface of the die and a die attach film on the die where the die attach film includes one …

In a described example, an apparatus includes: a package substrate having a die pad
configured for mounting a semiconductor die, a first lead connected to the die pad, and a …

The present disclosure teaches a method for manufacturing a module comprising an
integrated circuit and a sensor. The method may comprise: mounting an integrated circuit …

A semiconductor device, such as a semiconductor power device, includes: a semiconductor
die having a semiconductor die front surface, a package formed onto the semiconductor die …

A method includes applying a die attach material to a die pad of an integrated circuit
package. The die attach material is employed as a bonding material to the die pad. The …