The surface finish (SF) becomes a part of the solder joint during assembly and improves the
component's reliability. Furthermore, the SF influences the solder joint's reliability by …

The failure of one solder joint out of the hundreds of joints in a system compromises the
reliability of the electronics assembly. Thermal cycling is a result of both creep–fatigue …

The reliability of solder joints has been a serious concern since SAC based alloys replaced
tin-lead solder, especially in harsh thermal cycling conditions. Aging at a high temperature …

Failure due to thermal cycling is common at the solder joint level of electronic assemblies
due to the mismatch in the coefficient of thermal expansions between the carrier and printed …

SnAgCu (SAC) alloys that were a replacement for traditional Tin-Lead (SnPb) alloy has
been around for about two decades. Since the detrimental effects of aging were observed …

In this paper, a direct comparison was conducted between SnPb and lead-free solder joints
focused on long-term thermal cycling reliability after being exposed to high-temperature …

In harsh applications, the electronic systems' reliability relies on the mechanical integrity of
hundreds of solder interconnection against various triggers. The reliability is threatened by …

There has been a strong drive to remove Lead from electronics since the early 2000s.
Solder alloys based on tin (Sn), copper (Cu) and silver (Ag) were regarded as promising …