During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Introducing foreign reinforcements into solder joints has been demonstrated to be beneficial
to promoting the soldering reliability. In this work, Ni-decorated reduced graphene oxide (Ni …

This review covers recent applications of wet etching on solder alloys. Detailed
characterization cases are presented and discussed accordingly to highlight the process …

The development of high density and high integration of electronic chips puts forward stricter
requirements on electronic packaging structures. Under the premise of lead-free rules, Sn …

Purpose The research on lead-free solder alloys has increased in past decades due to
awareness of the environmental impact of lead contents in soldering alloys. This has led to …

SAC305 lead-free solder alloy is widely used in the electronic industry. However, the
problems associated with the growth formation of intermetallic compounds need further …

Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys
(Sn-x Cu, x= 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser …

Solder joint, crucial component in electronic systems, face significant challenges when
exposed to extreme conditions during applications. The solder joint reliability involving …

Purpose This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints
with different bonding temperature under ultrasonic-assisted. Design/methodology/approach …

Purpose This paper aims to study the effect of different Ni content on the microstructure and
properties of Sn-0.7 Cu alloy. Then, the spreading area, wetting angle, interface layer …