Spheroidized ferrite-cementite steel (SFC) is susceptible to micro-defects owing to the
mismatched deformation between the ferrite and cementite during cold forming, which …

Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …

This paper presents a multi-scale modelling approach to investigate the underpinning
mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5 Cu (wt …

A non-local method for the establishment of geometrically necessary dislocation (GND)
based on a non-local domain integral has been developed and incorporated into crystal …

Because typical solder joints undergo thermal aging during use, models simulating the
behaviors of solder under mechanical stress must accurately reflect the changes in …

In the service of electronic products, owing to thermal cycling and external additional loads,
solder joints undergo thermomechanical coupled cyclic loading. To fully understand the …

In this work, a mechanistic steady-state creep model is proposed for pure metallic materials
to characterize the evolution of macroscopic creep strain rate as a function of the testing …

In this work, we have developed a temperature-dependent, multi-mechanism crystal
plasticity (CP) model aimed at unravelling the deformation and failure resistance of Cantor …

Creep can have a significant impact on the reliability of Sn-based solder alloys even at room
temperature because of their relatively low melting temperatures. SnAgCu (SAC) solder …

Abstract Eutectic Ag3Sn can grow with a variety of morphologies depending on the
solidification conditions and plays an important role in the performance of Pb-free solders …