Spatially resolved precise prediction of local temperature T (x, y, z) is essential to evaluate
Arrhenius-activated interconnect (eg, electromigration) and transistor reliability (eg, NBTI …

The effects of moisture on the electrical properties of epoxy molding compounds containing
high quantities of silica filler microparticles have been investigated by means of dielectric …

Molding compounds (MCs) are widely used as an encapsulation material for integrated
circuits; however, traditional MCs are susceptible to moisture and charge spreading over …

High electric fields and temperatures in high-voltage ICs (HV-ICs) can induce charge
transport phenomena in the encapsulation material leading to reliability test failures. In this …

Amorphous composite polymers are widely used as insulators in microelectronics due to
their high dielectric strength, mechanical robustness, and thermal stability. However, organic …

To meet the growing demand for integrated circuits (ICs) in increasingly complex and
demanding applications, the semiconductor industry has evolved dramatically during the …

Abstract Epoxy Mold Compounds (EMC) are used to protect integrated circuits (IC) from
environmental influences, with one of these influences being moisture ingress, causing …

Stacked intermetal dielectrics grown by a Plasma Enhanced Chemical Vapor Deposition
(PECVD) technique are widely used as a capacitive voltage divider to integrate low and high …

Electronics make up a large part of our modern life. Today's electric devices often contain
microelectronics. These are transistors, resistors etc. grouped together, so small that their …