Low dielectric constant materials

W Volksen, RD Miller, G Dubois - Chemical reviews, 2010 - ACS Publications
Modern computer microprocessor chips are marvels of engineering complexity. For the
current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 …

Imprinting well-controlled closed-nanopores in spin-on polymeric dielectric thin films

M Ree, J Yoon, K Heo - Journal of Materials Chemistry, 2006 - pubs.rsc.org
The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated
circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation …

Porosity scaling strategies for low-k films

DJ Michalak, JM Blackwell, JM Torres… - Journal of Materials …, 2015 - cambridge.org
Reducing the delay of backend interconnects is critical in delivering improved performance
in next generation computer chips. One option is to implement interlayer dielectric (ILD) …

Thermally stable antireflective coatings based on nanoporous organosilicate thin films

S Kim, J Cho, K Char - Langmuir, 2007 - ACS Publications
Thermally stable nanoporous organosilicate thin films were realized by the microphase
separation of pore-generating polymers mixed with an organosilicate matrix to be …

Application of the protection/deprotection strategy to the science of porous materials

T Frot, W Volksen, S Purushothaman, R Bruce… - Advanced …, 2011 - infona.pl
Selective protection of the porosity can be implemented in porous materials processing by
using an organic polymer fill. This strategy is employed to protect ultralow‐k (ULK) materials …

A superelastic, biofluid-locking, and degradable dressing for wound healing

W Jiang, X Hou, X Guo, M Zhu, X Lin, Z Zhang… - Carbohydrate …, 2025 - Elsevier
In medical field, light-weight, superelastic, and super-absorbing aerogels are highly desired
for sensitive wounds with persistent exudations. Up to now, superelastic PU porous …

Post porosity plasma protection: Scaling of efficiency with porosity

T Frot, W Volksen, S Purushothaman… - Advanced Functional …, 2012 - Wiley Online Library
Increasing the porosity of oxycarbosilane dielectrics is a key approach to lower the
interconnect signal delay and thus enable manufacturing of lower power consumption and …

Pore sealing by NH3 plasma treatment of porous low dielectric constant films

HG Peng, DZ Chi, WD Wang, JH Li… - Journal of the …, 2007 - iopscience.iop.org
Porous interlayer dielectric films with interconnected pores pose a serious challenge for their
integration into next-generation microchips. The opening of interconnected pores in the …

Biocompatible carboxymethyl cellulose-based super-elastic hierarchical sponge via a novel templating and plasticizing method

X Guo, Q Zhang, M Zhu, D Zhao, J Yang, J Zhao… - Carbohydrate …, 2023 - Elsevier
Herein, a facile method to fabricate hierarchical super-elastic (SE) sponge using a water-
soluble cellulose derivative, carboxymethyl cellulose (CMC), is reported. The method …

Hydrolytic polycondensation of methylalkoxysilanes under pressure

AA Kalinina, DN Kholodkov, IB Meshkov… - Russian Chemical …, 2016 - Springer
Hydrolytic polycondensation of methytrialkoxysilanes under the pressure in water and in
carbonic acid was investigated. It is shown, that both processes proceed with full conversion …