Low dielectric constant materials
Modern computer microprocessor chips are marvels of engineering complexity. For the
current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 …
current 45 nm technology node, there may be nearly a billion transistors on a chip barely 1 …
Imprinting well-controlled closed-nanopores in spin-on polymeric dielectric thin films
M Ree, J Yoon, K Heo - Journal of Materials Chemistry, 2006 - pubs.rsc.org
The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated
circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation …
circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation …
Porosity scaling strategies for low-k films
DJ Michalak, JM Blackwell, JM Torres… - Journal of Materials …, 2015 - cambridge.org
Reducing the delay of backend interconnects is critical in delivering improved performance
in next generation computer chips. One option is to implement interlayer dielectric (ILD) …
in next generation computer chips. One option is to implement interlayer dielectric (ILD) …
Thermally stable antireflective coatings based on nanoporous organosilicate thin films
Thermally stable nanoporous organosilicate thin films were realized by the microphase
separation of pore-generating polymers mixed with an organosilicate matrix to be …
separation of pore-generating polymers mixed with an organosilicate matrix to be …
Application of the protection/deprotection strategy to the science of porous materials
Selective protection of the porosity can be implemented in porous materials processing by
using an organic polymer fill. This strategy is employed to protect ultralow‐k (ULK) materials …
using an organic polymer fill. This strategy is employed to protect ultralow‐k (ULK) materials …
A superelastic, biofluid-locking, and degradable dressing for wound healing
W Jiang, X Hou, X Guo, M Zhu, X Lin, Z Zhang… - Carbohydrate …, 2025 - Elsevier
In medical field, light-weight, superelastic, and super-absorbing aerogels are highly desired
for sensitive wounds with persistent exudations. Up to now, superelastic PU porous …
for sensitive wounds with persistent exudations. Up to now, superelastic PU porous …
Post porosity plasma protection: Scaling of efficiency with porosity
T Frot, W Volksen, S Purushothaman… - Advanced Functional …, 2012 - Wiley Online Library
Increasing the porosity of oxycarbosilane dielectrics is a key approach to lower the
interconnect signal delay and thus enable manufacturing of lower power consumption and …
interconnect signal delay and thus enable manufacturing of lower power consumption and …
Pore sealing by NH3 plasma treatment of porous low dielectric constant films
HG Peng, DZ Chi, WD Wang, JH Li… - Journal of the …, 2007 - iopscience.iop.org
Porous interlayer dielectric films with interconnected pores pose a serious challenge for their
integration into next-generation microchips. The opening of interconnected pores in the …
integration into next-generation microchips. The opening of interconnected pores in the …
Biocompatible carboxymethyl cellulose-based super-elastic hierarchical sponge via a novel templating and plasticizing method
X Guo, Q Zhang, M Zhu, D Zhao, J Yang, J Zhao… - Carbohydrate …, 2023 - Elsevier
Herein, a facile method to fabricate hierarchical super-elastic (SE) sponge using a water-
soluble cellulose derivative, carboxymethyl cellulose (CMC), is reported. The method …
soluble cellulose derivative, carboxymethyl cellulose (CMC), is reported. The method …
Hydrolytic polycondensation of methylalkoxysilanes under pressure
Hydrolytic polycondensation of methytrialkoxysilanes under the pressure in water and in
carbonic acid was investigated. It is shown, that both processes proceed with full conversion …
carbonic acid was investigated. It is shown, that both processes proceed with full conversion …