The authors have done an excellent job of clearly explaining the different nomenclature
used in plasma processing, with the meaning of the symbols and constants commonly …

An overview is given of recent theoretical concepts and experimental findings with respect to
the flicker or 1/f noise in advanced silicon MOSFETs. First, a summary will be given of the …

The increasing demand for the higher performance of ultra-large-scale integration (ULSI)
circuits requires the aggressive shrinkage of device feature sizes in accordance with the …

The continuous down-scaling of electronic devices and the introduction of functionally
improved novel materials require a greater atomic level controllability in the synthesis and …

With devices being scaled down to the nanometer regime, the need for atomic thickness
control with high conformality is increasing. Atomic layer deposition (ALD) is a key …

The increasing demand for higher performance of ULSI circuits requires aggressive
shrinkage of device feature sizes in accordance with Moore's law. Plasma processing plays …

In many high technology industries low pressure plasmas have become indispensable for
advanced materials processing: the microelectronics industry employs plasma-based …

Implantable medical electronics are differentiated from most of the other electronic-system
implementations by their unique combination of extreme low-power and high-reliability …

Plasma enhanced atomic layer deposition (PEALD) TaCN deposited on HfO 2 was studied
by X-ray photoelectron spectroscopy (XPS) to understand the reactions taking place at the …

Flexible hybrid electronics (FHE) is an emerging area that combines printed electronics and
ultra‐thin chip (UTC) technology to deliver high performance needed in applications such as …