In today's integrated circuit (IC) ecosystem, owning a foundry is not economically viable, and
therefore most IC design houses are now working under a fabless business model. In order …

The significantly increased number of routing design rules at sub-20nm nodes has made pin
access one of the most critical challenges in detailed routing. Resolving pin access issues in …

Self-aligned double patterning (SADP) is one of the most promising techniques for sub-
20nm technology. Spacer-is-dielectric SADP using a cut process is getting popular because …

Recently, directed self-assembly (DSA) has emerged as a promising lithography solution for
cut manufacturing. We perform a comprehensive study on the DSA aware mask optimization …

Unidirectional design has attracted lots of attention with the scaling down of technology
nodes. However, due to the limitation of traditional lithography, printing the randomly …

As the feature size keeps scaling down and the circuit complexity increases rapidly, a more
advanced hybrid lithography, which combines multiple patterning and electron-beam …

Directed self-assembly (DSA) technology has emerged as a promising candidate for cut
printing in advanced 1-D gridded layouts, where cuts might need to be redistributed such …

Directed-self-assembly (DSA) technology is a promising candidate for cut printing in sub-
10nm 1-D gridded designs, where cuts might need to be redistributed such that they could …

Self-aligned multiple patterning (SAMP), due to its low overlay error, has emerged as the
leading option for 1D gridded back-end-of-line (BEOL) in sub-14nm nodes. To form actual …

Split fabrication is a promising approach to security against attacks by untrusted foundries.
While existing split fabrication methods consider the overhead of conventional objectives …