Paralleling of IGBT power semiconductor devices and reliability issues

RN Tripathi, I Omura - Electronics, 2023 - mdpi.com
Paralleling of power semiconductor devices is inevitable considering their widespread
application and exploitation in the extended horizon of these applications. However …

AC power cycling test setup and condition monitoring tools for SiC-based traction inverters

M Farhadi, BT Vankayalapati… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
AC power cycling tests allow the most realistic reliability assessment by applying close to
real stress to the device or module under test to meet functional safety standards, which is …

Gate-oxide degradation monitoring of SiC MOSFETs based on transfer characteristic with temperature compensation

M Farhadi, BT Vankayalapati… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Gate-oxide degradation is a concern in silicon carbide (SiC) MOSFETs especially in safety-
critical applications such as aerospace and electric vehicles (EVs). To address this concern …

Conventional and topologically optimized polymer manifolds for direct cooling of power electronics

AA Lad, A Tayade, MJ Hoque, Y Zhao, JC Balda… - International Journal of …, 2023 - Elsevier
Single-phase liquid-cooled heat sinks are a preferred mode of thermal management for
many power dense electronic applications. This paper studies the design, optimization, and …

Fault-tolerant performance enhancement of DC-DC converters with high-speed fault clearing-unit based redundant power switch configurations

T Rahimi, HK Jahan, A Abadifard… - 2021 IEEE Electrical …, 2021 - ieeexplore.ieee.org
Fault detection and reconfiguration in fault-tolerant converters may complicated and
necessitate using all-purpose microprocessors and high-speed sensors to guarantee the …

Fin Design Topology Optimization for Direct Liquid Cooling of Multi-Chip Power Modules

AA Lad, E Roman, Y Zhao, WP King… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
This article demonstrates the use of topology optimization (TO) to generate optimal fin
designs capable of high heat flux removal without increasing the pumping power. We use …

Fuzzy lifetime analysis of a fault-tolerant two-phase interleaved converter

T Rahimi, M Farhadi, KH Loo… - 2021 IEEE 13th …, 2021 - ieeexplore.ieee.org
Interleaved converters are used in photovoltaic (PV) applications to handle high power
conditions with high reliability. To improve the reliability of these converters, redundant …

Non-isolated single-switch zeta based high-step up DC-DC converter with coupled inductor

A Abadifard, P Ghavidel, SH Hosseini… - 2021 31st …, 2021 - ieeexplore.ieee.org
In this paper, a non-isolated high step-up DC-DC converter has been proposed for
renewable energy applications. The proposed structure converter has been derived from the …

Topology optimized fin designs for base plate direct-cooled multi-chip power modules

AA Lad, E Roman, Y Zhao, WP King… - 2023 22nd IEEE …, 2023 - ieeexplore.ieee.org
Advances in wide bandgap (WBG) semiconductor technologies have enabled the
development of highly-compact multi-chip power modules for various applications. Direct …

Reliability and Condition Monitoring of Sic Power MOSFETs

M Farhadi - 2023 - search.proquest.com
Abstract Silicon Carbide (SiC) power devices have witnessed increasing mainstream
adoption in transportation over the past decade. This is mainly because of the SiC's high …