Effect of the heat dissipation system on hard-switching GaN-based power converters for energy conversion
D Lumbreras, M Vilella, J Zaragoza, N Berbel, J Jordà… - Energies, 2021 - mdpi.com
The design of a cooling system is critical in power converters based on wide-bandgap
(WBG) semiconductors. The use of gallium nitride enhancement-mode high-electron …
(WBG) semiconductors. The use of gallium nitride enhancement-mode high-electron …
Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2 composite solder paste
The reliability of the surface-mounted power transistors soldered by SAC0307-TiO2
composite solder paste was investigated. For the measurements, the power cycling method …
composite solder paste was investigated. For the measurements, the power cycling method …
Influence of Parasitic Capacitances and Inductances in a Power Electronic Converter on Junction Temperature of Power GaN HEMTs
P Górecki, D Ahmed - … on Mixed Design of Integrated Circuits …, 2024 - ieeexplore.ieee.org
GaN HEMTs are increasingly popular in power electronics applications. Their main
advantage over other power semiconductor devices is low switching losses. However, it …
advantage over other power semiconductor devices is low switching losses. However, it …
Optimal design of heat dissipation on low power PCB
H Zhang, W Wang, J Deng - Ferroelectrics, 2022 - Taylor & Francis
With the application of higher and higher power density IC in power driver circuits, an
efficient modeling method of thermal design and heat dissipation is desired. In this paper …
efficient modeling method of thermal design and heat dissipation is desired. In this paper …