It is well known that the elastoplastic properties of materials are important indicators to
characterize their mechanical behaviors and are of guiding significance in the field of …

A mesoscopic constitutive model coupled with crystal plasticity (CP) and damage is
established in this paper to investigate the plastic deformation and damage-induced …

As one of the promising packaging materials, the paste of silver nanoparticles (AgNPs)
reinforced by SiC particles is investigated in this study for microstructure, thermal stability …

Sintered silver is a very promising option in the field of automotive power electronics for die-
attach and substrate-attach material as it offers many benefits compared to conventional …

The quantity and variety of parameters involved in the failure evolutions in solder joints
under a thermo-mechanical process directs the reliability assessment of electronic devices …

Nanoindentation technology is an effective and convenient method for evaluating the
mechanical properties of materials at micro and nano scales. Since the complete …

This paper deals with the effects of electric current on the thermomechanical lifetime of
solder joint as the most vulnerable part in electronic packages. The main focus of this paper …

During the sintering process, a three-dimensional network-like porous structure forms as the
consequences of atom diffusion and neck formation among silver particles. In this paper, two …

Size effect of the nickel-based single crystal superalloy DD6 is investigated in this study by
performing nanoindentation experiments and finite element (FE) simulations by …

Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh
operating environment, three surface finishes of sputtered Ti/Ag-layers, electroless Ni-/Pt-/Ag …