From cell phones to biomedical systems, modern life is inexorably dependent on the
complex convergence of technologies into stand-alone products designed to provide a …

In the past, microsystems packaging played two roles: 1) it provided I/O connections to and
from integrated circuits (ICs) or wafer-level packaging (WLP), and 2) it interconnected both …

Electronics packaging evolution involves system, technology, and material considerations.
In this paper, we present a novel three-dimensional (3-D) integration approach for system …

The system-on-a-package (SOP) concept is considered as the solution of future
communication modules, where more functionality, better performance, low cost, and more …

In this paper, a 77-GHz automotive radar sensor transceiver front-end module is packaged
with a novel embedded wafer level packaging (EMWLP) technology. The bare transceiver …

In this paper, a 3-D integrated 77-GHz automotive radar front-end is presented. Embedded
wafer level packaging (EMWLP) technology is proposed to eliminate the use of wire …

In this paper, a CPW-fed antenna-in-package (AiP) operating at millimeter wave (mmWave)
based on a wafer-level packaging technology with through silicon via (TSV) …

We have designed and fabricated both single-coil and parallel-coil magnetic integrated
inductors with extremely small resistances and high quality factors on an 8-in-round printed …

The main aim of this paper is to present the new design of an integrated planar spiral
inductor with a new structure of an underpass to obtain a high inductance, high quality factor …

This paper presents advanced multilayer (ML) thick film system-on-package (SOP)
technology for realization of ceramic-based embedded coplanar waveguide (CPW) …