Stretchable anisotropic conductive film (S-ACF) for electrical interfacing in high-resolution stretchable circuits

H Hwang, M Kong, K Kim, D Park, S Lee, S Park… - Science …, 2021 - science.org
In stretchable electronics, high-resolution stretchable interfacing at a mild temperature is
considered as a great challenge and has not been achieved yet. This study presents a …

Soft conductive interfacing for bioelectrical uses: adhesion mechanisms and structural approaches

J Kim, J Oh, Y Park, JJ Kim, U Jeong - Macromolecules, 2023 - ACS Publications
Soft conductors are critical components in soft electronic devices. As soft conductors are
applied in high-profit applications in bioelectronics to be attached to the skin and internal …

A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints

Z Liu, YA Huang, Z Yin, S Bennati, PS Valvo - International Journal of …, 2014 - Elsevier
This paper presents an efficient analytical solution strategy to determine the adhesive
stresses in balanced and unbalanced adhesively bonded joints with mixed force loading …

High-rate roll-to-roll stack and lamination of multilayer structured membrane electrode assembly

J Chen, H Liu, YA Huang, Z Yin - Journal of Manufacturing Processes, 2016 - Elsevier
A membrane electrode assembly (MEA) is the heart of a proton exchange membrane (PEM)
fuel cell stack. The presented roll-to-roll (R2R) system is initially developed for the mass …

Reliable peeling of ultrathin die with multineedle ejector

Z Liu, YA Huang, H Liu, J Chen… - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
Flip chip packaging as a mainstream packaging interconnect technology has proliferated
rapidly within the last decade or so. With the applications of high-performance chip, its …

Dynamic peeling process of IC chip from substrate based on a 3D analytical model

J Fu, W Du, H Hou, X Zhao, T Wu - International Journal of Solids and …, 2023 - Elsevier
A 3D analytical approach is proposed to investigate the peeling mechanism of IC chip from
substrate, which is important for reliable electronic packaging. Chip-adhesive-substrate …

Tunable peeling technique and mechanism of thin chip from compliant adhesive tapes

Z Liu, YA Huang, J Chen, Z Yin - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
The efficient pick-up of thin/ultrathin integrated circuit chip from the wafer is one of the key
techniques in advanced microelectronic packaging, whose success rates are determined by …

Conformal peeling of device-on-substrate system in flexible electronic assembly

YA Huang, H Liu, Z Xu, J Chen… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
Continuous peeling of thin chips and flexible devices from a donor to an acceptor is critical
for high-efficiency roll-to-roll (R2R) manufacturing of flexible electronics. Here, we propose …

Competing behavior of interface delamination and wafer cracking during peeling film from ultra-thin wafer

W Jian, H Yin, Y Chen, X Feng - International Journal of Solids and …, 2024 - Elsevier
Peeling the front-side film from the flexible and ultra-thin wafer is a critical procedure for the
fabrication of ultra-thin chips. For a successful peeling process, the following conditions are …

Theoretical and experimental studies of competing fracture for flexible chip-adhesive-substrate composite structure

Z Liu, X Wan, YA Huang, J Chen… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
Competing fracture of chip peeling and chip cracking dominates the fast, nondestructive,
and reliable peeling of ultrathin silicon-based chip from polymeric substrate. Here, a …