Stretchable anisotropic conductive film (S-ACF) for electrical interfacing in high-resolution stretchable circuits
In stretchable electronics, high-resolution stretchable interfacing at a mild temperature is
considered as a great challenge and has not been achieved yet. This study presents a …
considered as a great challenge and has not been achieved yet. This study presents a …
Soft conductive interfacing for bioelectrical uses: adhesion mechanisms and structural approaches
Soft conductors are critical components in soft electronic devices. As soft conductors are
applied in high-profit applications in bioelectronics to be attached to the skin and internal …
applied in high-profit applications in bioelectronics to be attached to the skin and internal …
A general solution for the two-dimensional stress analysis of balanced and unbalanced adhesively bonded joints
This paper presents an efficient analytical solution strategy to determine the adhesive
stresses in balanced and unbalanced adhesively bonded joints with mixed force loading …
stresses in balanced and unbalanced adhesively bonded joints with mixed force loading …
High-rate roll-to-roll stack and lamination of multilayer structured membrane electrode assembly
A membrane electrode assembly (MEA) is the heart of a proton exchange membrane (PEM)
fuel cell stack. The presented roll-to-roll (R2R) system is initially developed for the mass …
fuel cell stack. The presented roll-to-roll (R2R) system is initially developed for the mass …
Reliable peeling of ultrathin die with multineedle ejector
Flip chip packaging as a mainstream packaging interconnect technology has proliferated
rapidly within the last decade or so. With the applications of high-performance chip, its …
rapidly within the last decade or so. With the applications of high-performance chip, its …
Dynamic peeling process of IC chip from substrate based on a 3D analytical model
J Fu, W Du, H Hou, X Zhao, T Wu - International Journal of Solids and …, 2023 - Elsevier
A 3D analytical approach is proposed to investigate the peeling mechanism of IC chip from
substrate, which is important for reliable electronic packaging. Chip-adhesive-substrate …
substrate, which is important for reliable electronic packaging. Chip-adhesive-substrate …
Tunable peeling technique and mechanism of thin chip from compliant adhesive tapes
The efficient pick-up of thin/ultrathin integrated circuit chip from the wafer is one of the key
techniques in advanced microelectronic packaging, whose success rates are determined by …
techniques in advanced microelectronic packaging, whose success rates are determined by …
Conformal peeling of device-on-substrate system in flexible electronic assembly
YA Huang, H Liu, Z Xu, J Chen… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
Continuous peeling of thin chips and flexible devices from a donor to an acceptor is critical
for high-efficiency roll-to-roll (R2R) manufacturing of flexible electronics. Here, we propose …
for high-efficiency roll-to-roll (R2R) manufacturing of flexible electronics. Here, we propose …
Competing behavior of interface delamination and wafer cracking during peeling film from ultra-thin wafer
W Jian, H Yin, Y Chen, X Feng - International Journal of Solids and …, 2024 - Elsevier
Peeling the front-side film from the flexible and ultra-thin wafer is a critical procedure for the
fabrication of ultra-thin chips. For a successful peeling process, the following conditions are …
fabrication of ultra-thin chips. For a successful peeling process, the following conditions are …
Theoretical and experimental studies of competing fracture for flexible chip-adhesive-substrate composite structure
Competing fracture of chip peeling and chip cracking dominates the fast, nondestructive,
and reliable peeling of ultrathin silicon-based chip from polymeric substrate. Here, a …
and reliable peeling of ultrathin silicon-based chip from polymeric substrate. Here, a …