[HTML][HTML] A review of high magnetic moment thin films for microscale and nanotechnology applications
G Scheunert, O Heinonen, R Hardeman… - Applied Physics …, 2016 - pubs.aip.org
The creation of large magnetic fields is a necessary component in many technologies,
ranging from magnetic resonance imaging, electric motors and generators, and magnetic …
ranging from magnetic resonance imaging, electric motors and generators, and magnetic …
Impact of substrate and process on the electrical performance of screen-printed nickel electrodes: fundamental mechanism of ink film roughness
BN Altay, J Jourdan, VS Turkani… - ACS Applied Energy …, 2018 - ACS Publications
In recent years, traditional printing methods have been integrated to print flexible electronic
devices and circuits. Since process requirements for electronics differ from those for graphic …
devices and circuits. Since process requirements for electronics differ from those for graphic …
[HTML][HTML] Improving surface-enhanced Raman scattering performance of gold-modified magnetic nanoparticles by using nickel-phosphorus film on …
CB Adamo, RJ Poppi, DP de Jesus - Microchemical Journal, 2021 - Elsevier
This work demonstrated that a Ni-P film deposited on polydimethylsiloxane (PDMS)
substrate could influence the magnetic aggregation of gold-modified magnetic nanoparticles …
substrate could influence the magnetic aggregation of gold-modified magnetic nanoparticles …
Wet treatment and the behavior of electroless Ni-P deposition at 40 C on polished alumina
The morphology and adhesion strength of the autocatalytic electroless nickel phosphorus
(Ni-P) film, deposited at 40 ºC on polished alumina (Al2O3 99.6%) substrate, pretreated by …
(Ni-P) film, deposited at 40 ºC on polished alumina (Al2O3 99.6%) substrate, pretreated by …
Comparative analysis of thin Ni and CoNiMnP magnetic films
CDM Campos, A Flacker, SA Moshkalev… - Thin Solid Films, 2012 - Elsevier
The results of an investigation of thin Ni and CoNiMnP films deposited by electroplating over
polyurethane-acrylate flexible substrates are presented. To improve magnetic properties of …
polyurethane-acrylate flexible substrates are presented. To improve magnetic properties of …
Integration of microfabricated capacitive bridge and thermistor on the alumina substrates
JS Costa, A Flacker, MHS Nakashima, F Fruett… - ECS …, 2012 - iopscience.iop.org
This paper describes a thin film fabrication technique of planar metallic microstructure with
geometries between 10 and 20μm on 96% alumina substrate. This technique integrates a …
geometries between 10 and 20μm on 96% alumina substrate. This technique integrates a …
Multi-chip module (MCM-D) using thin film technology
CB Adamo, A Flacker, W Freitas… - … 29th Symposium on …, 2014 - ieeexplore.ieee.org
This work presents results of the Multi-Chip Module-Deposited technology built with thin film
processes over a substrate of alumina and oxidized silicon that was used to micro-fabricate …
processes over a substrate of alumina and oxidized silicon that was used to micro-fabricate …
[HTML][HTML] Morphology Behavior of Copper Films Deposited after Wet Surface Treatment on Polished Alumina
A Flacker, GC Gomes, MO Silva… - Journal of the Brazilian …, 2022 - SciELO Brasil
In this paper, a pre-treatment process for electroless copper (Cu) deposition on the polished
alumina (Al2O3) 99.9% and the behavior of Cu plating by electroless process after Al2O3 …
alumina (Al2O3) 99.9% and the behavior of Cu plating by electroless process after Al2O3 …
Electrodeposition and Characterization of Co Particles on Ultrathin Polypyrrole Films
Ultrathin polypyrrole (PPy) films with the thicknesses of 20, 50, and 100 nm were prepared
by electropolymerization. Co particles with a charge density in the range of 125–1,250 mC …
by electropolymerization. Co particles with a charge density in the range of 125–1,250 mC …
Alternative technological development for RF hybridization
CA Finardi, A da Fontoura Ponchet… - Materials Research …, 2017 - iopscience.iop.org
The paper presents a technological solution for high frequency packaging platform
evaluated up to 40 GHz. The main purpose of this development was to define an alternative …
evaluated up to 40 GHz. The main purpose of this development was to define an alternative …