The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …

The growth kinetics and rate-controlling processes of intermetallic layers formed in Cu/(Sn-
58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples …

Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling
performance in harsher conditions. Here, we investigate microstructure evolution and failure …

With miniaturization and heterogeneous integration in packaging, there has been a drive
toward developing lower temperature solders. Sn-58Bi eutectic solder provides an attractive …

In this study, Bi was added to pure Sn to improve its strength and thermal properties. The
presence of 2.5 and 5 wt.% Bi in the Sn matrix lowered the melting point of Sn from 232° C to …

Alloys based on the Sn-Bi system are widely considered as the most promising candidates
for low temperature solders (LTS) in the electronics industry due to their low liquidus …

With the advance in heterogeneous integration packaging, there has been a demand for
solders with ideal mechanical properties and ideal melting temperatures. Sn-Ag-Cu (SAC) …

Sn-Ag-Cu-Bi (SAC-Bi) alloys are gaining popularity as a potential replacement for current
lead-free solder alloys in microelectronic packages. In this study, the tensile and viscoplastic …

Abstract The effects of Sb/In (with a loading x of 1, 2, 3 wt.%) in the Sn5Bi solder alloy on the
melting properties, microstructures, and the shear behavior of solder/Cu joints were …

The investigation of a prospective lead-free solder alloy provides the essential data for
microelectronic applications and estimation of solder joint reliability. In this study, we used …