Porous conductive textiles for wearable electronics

Y Ding, J Jiang, Y Wu, Y Zhang, J Zhou… - Chemical …, 2024 - ACS Publications
Over the years, researchers have made significant strides in the development of novel
flexible/stretchable and conductive materials, enabling the creation of cutting-edge …

Additively manufactured flexible on-package phased antenna arrays with integrated microfluidic cooling channels for 5G/mmwave system-on-package designs

K Hu, TW Callis, MM Tentzeris - IEEE Microwave and Wireless …, 2023 - ieeexplore.ieee.org
A fully additively manufactured flexible reconfigurable on-package antenna array with an
integrated microfluidic cooling channel is introduced. The proposed design is a multilayer …

Planar SiC Power Module Packaging and Interconnections Using Direct Ink Writing

R Al-Haidari, M Alhendi, D Richmond… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Traditional device packaging becomes a limiting factor in realizing the full performance
potential of SiC. Thus, improved and advanced packaging technologies are required to …

Additive Manufacturing of Radio Frequancy (RF) Components on Flexible Substrates

AS Obeidat - 2022 - search.proquest.com
Additive manufacturing is an attractive technique in electronic fabrication due to material
savings and lower cost of processing. Microstrip lines are used for communication and …

Conformal Dry Electrode for ECG Monitoring

R Al-Haidari, B Falola, M Alhendi… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
This work reports the fabrication and testing of a conformal and soft dry electrode for
Electrocardiogram (ECG) monitoring to address the limitations associated with traditional gel …

Electromechanical and Thermal Characterization of Printed Liquid Metal Ink on Stretchable Substrate for Soft Robotics Multi-Sensing Applications

EM Abbara, M Alhendi, R Al-haidari… - 2023 IEEE 73rd …, 2023 - ieeexplore.ieee.org
Electronic skins (e-skins) are widely used in wearables, robotics, and medical field. In this
paper we introduce a fabrication and characterization of a bio-inspired robot electronic skin …

Sensing Pad for Pressure Distribution Mapping

V Mateev, I Marinova - 2022 XXXI International Scientific …, 2022 - ieeexplore.ieee.org
Here is presented an interactive sensing pad for pressure distribution mapping in wide
surface area. The main task of the work is to prototype a concept of a sensing pad for …

[PDF][PDF] Applications of Additive Manufacturing in the Microelectronics Advanced Packaging Landscape

A Batjer, R Eames, R Burke, B Hamilton, C Riso… - researchgate.net
The US Department of Defense is investing heavily in advanced packaging research and
development to bolster domestic electronics manufacturing. Additively Manufactured …