Vertical RF transition with mechanical fit for 3-D heterogeneous integration
L Chen, J Wood, S Raman… - IEEE transactions on …, 2012 - ieeexplore.ieee.org
This paper presents the design, simulation, and measurement of a vertical RF interconnect
with mechanical fit for 3-D heterogeneous integration. The mechanical fit is a flip-chip …
with mechanical fit for 3-D heterogeneous integration. The mechanical fit is a flip-chip …
[PDF][PDF] Micromachined Millimeter-and Submillimeter-wave Circuits for Test and Integration
L Chen - 2012 - scholar.archive.org
The terahertz spectrum is critical to a wide range of scientific applications, from radio
astronomy to remote sensing. However, due to the cost, size and weight of terahertz …
astronomy to remote sensing. However, due to the cost, size and weight of terahertz …
[PDF][PDF] 3D Heterogeneous Integration Of Microwave/Millimeter-Wave Sensor And Communications Microsystems Using High-Aspect Ratio Micromachined" Building …
S Raman - 2013 - apps.dtic.mil
Prior work has demonstrated a new process utilizing room-temperature liquid metal,
Galinstan, as an interconnect material for flip-chip bonding. This interconnect forms a flexible …
Galinstan, as an interconnect material for flip-chip bonding. This interconnect forms a flexible …