During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Recently, interest in power modules is increasing in eco-friendly mobility such as electric
vehicles (EVs) and fuel cell electric vehicles (FCEVs). The power module is a key …

There is a high demand for the implementation of metallic nanoparticle (NP) sintering
technology for die attach in high-power electronics. The performance of this technology is …

Ag particles have been attractive candidates for highly reliable interconnections in electronic
packages due to an absence of IMCs, high melting temperature, and high electrical and …

This study introduces research trends in the electronics materials, such as joining materials
including high-temperature lead-free solder, sintered materials using metal particles and …

A transient liquid-phase infiltration process was successfully applied to the bonding of Cu
using a porous Ag insert sheet. Ag particles with a mean size of ϕ2 μm were sintered to form …

The feasibility of the highly reliable and replicable microstructure formation of the transient
liquid phase sintering (TLPS) paste during the early soldering and isothermal aging on the …

Crystal facets engineering and graphene hybridizing have been proved to be effective
means to improve the photocatalytic activities of semiconductor photocatalysts in recent …

Cu–Cu bonding was successfully achieved through the transient liquid phase sintering
(TLPS) bonding method using Cu and an eutectic Sn–Bi alloy. The bonding process was …

A carbon nanotube (CNT) has remarkable properties, but it has disadvantages in application
because of its dispersal-and bonding-related issues. Metal–CNT composite materials are …