Six cases of reliability study of Pb-free solder joints in electronic packaging technology
K Zeng, KN Tu - Materials science and engineering: R: reports, 2002 - Elsevier
Solder is widely used to connect chips to their packaging substrates in flip chip technology
as well as in surface mount technology. At present, the electronic packaging industry is …
as well as in surface mount technology. At present, the electronic packaging industry is …
Tin–lead (SnPb) solder reaction in flip chip technology
KN Tu, K Zeng - Materials science and engineering: R: reports, 2001 - Elsevier
Solder reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been
reviewed on the basis of the available data of morphology, thermodynamics, and kinetics …
reviewed on the basis of the available data of morphology, thermodynamics, and kinetics …
The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure
A Zribi, A Clark, L Zavalij, P Borgesen… - Journal of Electronic …, 2001 - Springer
The evolution of intermetallics at and near SnAgCu/Cu and SnAgCu/Ni interfaces was
examined, and compared to the behavior, near PbSn/metal and Sn/metal interfaces. Two …
examined, and compared to the behavior, near PbSn/metal and Sn/metal interfaces. Two …
Microstructure, joint strength and failure mechanisms of SnPb and Pb-free solders in BGA packages
M Li, KY Lee, DR Olsen, WT Chen… - IEEE transactions on …, 2002 - ieeexplore.ieee.org
The microstructure, joint strength and failure mechanisms of SnPbAg, SnAg and SnAgCu
solders on Cu/Ni/Au BGA pad metallization were investigated after multiple reflows or high …
solders on Cu/Ni/Au BGA pad metallization were investigated after multiple reflows or high …
Mechanical properties of intermetallic compounds in the Au–Sn system
RR Chromik, DN Wang, A Shugar, L Limata… - Journal of materials …, 2005 - cambridge.org
The mechanical properties of intermetallic compounds in the Au–Sn system were
investigated by nanoindentation. Measurements of hardness and elastic modulus were …
investigated by nanoindentation. Measurements of hardness and elastic modulus were …
The influence of room temperature aging on ball shear strength and microstructure of area array solder balls
RJ Coyle, PP Solan, AJ Serafino… - 2000 Proceedings. 50th …, 2000 - ieeexplore.ieee.org
Solder ball shear strength is determined for ball grid array (BGA) packages in the as-
received condition and after solder reflow preconditioning (exposure to multiple solder …
received condition and after solder reflow preconditioning (exposure to multiple solder …
Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages
The reactions between Sn–Ag–Cu lead‐free solders of various compositions and Au/Ni
surface finish in advanced electronic packages were studied. Three solder compositions, Sn …
surface finish in advanced electronic packages were studied. Three solder compositions, Sn …
Assessing the risk of “Kirkendall voiding” in Cu3Sn
P Borgesen, L Yin, P Kondos - Microelectronics Reliability, 2011 - Elsevier
A common location of sporadic, usually unpredictable, premature failures of both SnPb and
Pb-free solder joints is within the intermetallic bond to one of the contact pads. Cu pads tend …
Pb-free solder joints is within the intermetallic bond to one of the contact pads. Cu pads tend …
[PDF][PDF] Review of the impact of intermetallic layers on the brittleness of tin-lead and lead-free solder joints
PE Tegehall - IVF project report, 2006 - researchgate.net
Review of the Impact of Intermetallic Layers on the Brittleness of Tin-Lead and Lead-Free
Solder Joints Page 1 6-03-15 IVF Project Report 06/07 Review of the Impact of Intermetallic …
Solder Joints Page 1 6-03-15 IVF Project Report 06/07 Review of the Impact of Intermetallic …
Elimination of Au-embrittlement in solder joints on Au/Ni metallization
Systematic experimental work was carried out to understand the mechanism of Au diffusion
to the solder interface, and a novel method was proposed to eliminate Au embrittlement by …
to the solder interface, and a novel method was proposed to eliminate Au embrittlement by …