Solder is widely used to connect chips to their packaging substrates in flip chip technology
as well as in surface mount technology. At present, the electronic packaging industry is …

Solder reactions between SnPb and one of the four metals, Cu, Ni, Au, and Pd have been
reviewed on the basis of the available data of morphology, thermodynamics, and kinetics …

The evolution of intermetallics at and near SnAgCu/Cu and SnAgCu/Ni interfaces was
examined, and compared to the behavior, near PbSn/metal and Sn/metal interfaces. Two …

The microstructure, joint strength and failure mechanisms of SnPbAg, SnAg and SnAgCu
solders on Cu/Ni/Au BGA pad metallization were investigated after multiple reflows or high …

The mechanical properties of intermetallic compounds in the Au–Sn system were
investigated by nanoindentation. Measurements of hardness and elastic modulus were …

Solder ball shear strength is determined for ball grid array (BGA) packages in the as-
received condition and after solder reflow preconditioning (exposure to multiple solder …

The reactions between Sn–Ag–Cu lead‐free solders of various compositions and Au/Ni
surface finish in advanced electronic packages were studied. Three solder compositions, Sn …

A common location of sporadic, usually unpredictable, premature failures of both SnPb and
Pb-free solder joints is within the intermetallic bond to one of the contact pads. Cu pads tend …

Review of the Impact of Intermetallic Layers on the Brittleness of Tin-Lead and Lead-Free
Solder Joints Page 1 6-03-15 IVF Project Report 06/07 Review of the Impact of Intermetallic …

Systematic experimental work was carried out to understand the mechanism of Au diffusion
to the solder interface, and a novel method was proposed to eliminate Au embrittlement by …