The present disclosure provides three-dimensional (3D) printing processes, apparatuses,
software, and systems for the production of at least one desired 3D object. The 3D printer …

The present invention concerns a method and a device for estimating a level of damage or a
lifetime expectation of a power semiconductor module comprising at least one die that is …

The described techniques implement electronic designs with thermal analyses of the
electronic design and its surrounding medium by performing thermal modeling that …

A system and method for enabling the estimation and mitigation of self-heating in chip
designs at a much earlier stage in a design flow. The system and method provides unique …

The present disclosure provides three-dimensional (3D) printing systems, apparatuses,
software, and methods for the production of at least one requested 3D object. The 3D printer …

Provided herein are methods, apparatuses, and non-transitory computer readable media
concerning quality assurance of three-dimensional object (s) and their formation. In some …

Various aspects of the disclosed technology relate to techniques of determining an across-
chip distribution of temperature generated by on-chip devices. Effective thermal …