In this study, advanced packaging is defined. The kinds of advanced packaging are ranked
based on their interconnect density and electrical performance, and are grouped into 2-D …

Photonics die or integrated photonics modules co-packaged with compute engines have the
potential to deliver significant improvements in power, bandwidth and reach needed to meet …

The semiconductor industry is transitioning to the 'More Moore'era, driven by the adoption of
three-dimensional (3D) integration schemes surpassing the limitations of traditional two …

In the field of semiconductors, three-dimensional (3D) integration not only enables
packaging of more devices per unit area, referred to as 'More Moore'but also introduces …

First of all, semiconductor technology is out of the scope of this book and semiconductor
advanced packaging technology is the focus. In this chapter, the advanced packaging will …

With the continuous reduction of chip feature size, the continuation of Moore's Law becomes
increasingly difficult and heterogeneous integration has become one of the important …

The power delivery requirements for the early microprocessors were fairly rudimentary due
to the relatively low power levels. However, several decades of exponential scaling powered …

Ponte Vecchio (PVC) is a heterogenous petaop 3D processor comprising 47 functional tiles
on five process nodes. The tiles are connected with Foveros [1] and EMIB [2] to operate as a …

The next decade will usher in a new era of technological innovation where compute,
communications, and intelligence will converge. The number of connected devices is …

The Lakefield processor combines heterogeneous 3D die stacking also called Foveros, with
hybrid computing to enable a new class of small form factor mobile products. The stacked …