Improving the thermal conductance at the GaN/diamond interface is crucial for boosting GaN-
based device performance and reliability. In this study, first-principles calculations and …

Polymer-based thermally conductive composites are widely used in microelectronics for
heat dissipation and packaging, for which the filler arrangement and the filler/matrix …

Efficient interface management between diamond and metal is crucial for achieving optimal
performance in metal-matrix/diamond composites. Here, the Ti coatings prepared at various …

While various methods have been proposed to modulate interfacial heat transport in
semiconductors and metals, the intrinsic mechanisms by which twist angle affects interfacial …

To enhance interfacial thermal transport at the GaN/diamond interface is of significant
interest due to its potential applications in high-power electronic devices. In this work, we …

Cu/Diamond (Cu/Dia) composites are regarded as next-generation thermal dissipation
materials and hold tremendous potential for use in future high-power electronic devices. The …

This paper investigates the material removal behavior of diamond/Cu composites by multi-
passes infrared nanosecond pulsed laser ablation, focusing on the formed surface cracks …

The enhanced heat transfer at the metal/semiconductor interface is paramount for heat
dissipation in electronic devices. In this study, the non-equilibrium molecular dynamics …

An Mo interlayer can effectively enhance the thermal conductivity of diamond-copper
composite SPS diffusion welding interface. But the detailed microscopic mechanism …