Transistors based on two-dimensional materials for future integrated circuits

S Das, A Sebastian, E Pop, CJ McClellan… - Nature …, 2021 - nature.com
Field-effect transistors based on two-dimensional (2D) materials have the potential to be
used in very large-scale integration (VLSI) technology, but whether they can be used at the …

Hexagonal boron nitride for next‐generation photonics and electronics

S Moon, J Kim, J Park, S Im, J Kim, I Hwang… - Advanced …, 2023 - Wiley Online Library
Hexagonal boron nitride (h‐BN), an insulating 2D layered material, has recently attracted
tremendous interest motivated by the extraordinary properties it shows across the fields of …

Vapour-phase deposition of two-dimensional layered chalcogenides

T Zhang, J Wang, P Wu, AY Lu, J Kong - Nature Reviews Materials, 2023 - nature.com
Abstract Two-dimensional (2D) layered materials are attracting a lot of attention because of
unique physicochemical properties that are intriguing for both fundamental research and …

Plasma processing and treatment of 2D transition metal dichalcogenides: tuning properties and defect engineering

S Sovizi, S Angizi, SA Ahmad Alem, R Goodarzi… - Chemical …, 2023 - ACS Publications
Two-dimensional transition metal dichalcogenides (TMDs) offer fascinating opportunities for
fundamental nanoscale science and various technological applications. They are a …

Materials for interconnects

D Gall, JJ Cha, Z Chen, HJ Han, C Hinkle, JA Robinson… - MRS Bulletin, 2021 - Springer
The electrical resistance of interconnect wires increases with decreasing size, causing
signal delay and energy consumption that limits further downscaling of integrated circuits …

[HTML][HTML] Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

CL Lo, BA Helfrecht, Y He, DM Guzman… - Journal of Applied …, 2020 - pubs.aip.org
As the challenges in continued scaling of the integrated circuit technology escalate every
generation, there is an urgent need to find viable solutions for both the front-end-of-line …

Scalable Substitutional Re‐Doping and its Impact on the Optical and Electronic Properties of Tungsten Diselenide

A Kozhakhmetov, B Schuler, AMZ Tan… - Advanced …, 2020 - Wiley Online Library
Reliable, controlled doping of 2D transition metal dichalcogenides will enable the realization
of next‐generation electronic, logic‐memory, and magnetic devices based on these …

Materials quest for advanced interconnect metallization in integrated circuits

JH Moon, E Jeong, S Kim, T Kim, E Oh, K Lee… - Advanced …, 2023 - Wiley Online Library
Integrated circuits (ICs) are challenged to deliver historically anticipated performance
improvements while increasing the cost and complexity of the technology with each …

MoS2 as an Effective Cu Diffusion Barrier with a Back-End Compatible Process

CY Kuo, YT Chang, YT Huang, IC Ni… - … Applied Materials & …, 2023 - ACS Publications
This study demonstrates molybdenum disulfide (MoS2) as a superior candidate as a
diffusion barrier and liner. This research explores a newly developed process to show how …

Evaluating size effects on the thermal conductivity and electron-phonon scattering rates of copper thin films for experimental validation of Matthiessen's rule

MR Islam, P Karna, JA Tomko, ER Hoglund… - Nature …, 2024 - nature.com
As metallic nanostructures shrink towards the size of the electronic mean free path, thermal
conductivity decreases due to increased electronic scattering rates. Matthiessen's rule is …