Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip
assembly, and underfill will be presented in this study. Emphasis is placed on the latest …

This study was carried out to evaluate the performance of silica mineral composites in
comparison with conventional fused silica composites, which is commonly used as underfill …

The geometry of solder joints in the flip chip technologies is primarily determined by the
associated solder volume and die/substrate-side pad size. In this study, the effect of these …

To meet the future needs of high pin count and high performance, the LSI die and package
size of flip-chip BGA (FC-BGA) devices have become larger. As a result, package warpage …

To meet the future needs of high pin count and high performance, package size of flip-chip
devices is constrained to become larger. In addition, to fulfill the environment issues, lead …

Autonomous driving is a key vehicle capability for future mobility solutions that relies on the
reliability of its high-performance vehicle computer. As for any electronics for automotive …

The chip corner geometry and the mismatch of the coefficient of thermal expansion cause a
local stress concentration in the underfill near the chip corner area. Delamination at the chip …

The adhesion between the polymer matrix and the inorganic filler particles are the goal of
various and tremendous studies. This issue is still occupying a big part of the researchers …

The presence of an “underfill” encapsulant between a microelectronic device and the
underlying substrate is known to substantially improve the thermal fatigue life of flip-chip …

Accelerated thermal cycling (ATC) has been widely used in the microelectronics industry for
reliability assessment. The relative effects of thermal cycling parameters (temperature range …