Prior to any practical application, brittle material components may need to be machined to a
high degree of precision in order to avoid functional breakdown as well as to maintain …

Flexible electronics has significantly advanced over the last few years, as devices and
circuits from nanoscale structures to printed thin films have started to appear …

Grinding and lapping are two widely used machining processes for silicon wafer
planarization. Their resultant surface integrity has a significant impact on subsequent …

Hard and brittle materials (HBMs) are promising materials for aerospace and astronomy
applications, due to their excellent mechanical, optical, and chemical properties. However …

Semiconductor wastewater has recently become an emerging issue with the development of
semiconductor production owing to its severe toxicity and complexity. The increasing …

Atomic force microscopy (AFM) tip-based nanofabrication is as a powerful method to
machine nanostructures. However, the traditional AFM scratching process suffers from low …

Nanostructures in silicon (Si) induced by phase transformations have been investigated
during the past 50 years. Performances of nanostructures are improved compared to that of …

Flexible electronics has huge potential to bring revolution in robotics and prosthetics as well
as to bring about the next big evolution in electronics industry. In robotics and related …

It is a challenge to enhance the material removal rate (MRR) during the chemical
mechanical polishing (CMP) of silicon wafers, with increasing the size of a wafer and …

Ultra-precision thinning technology using workpiece self-rotational grinding followed by
chemical mechanical polishing (CMP) is extensively applied in the integrated circuit …