The effect of Cu-Sn intermetallic compounds (IMC) on the fatigue failure of solder joints
during thermal cycling has been studied. The samples consist of components [leadless …

This study investigates the influence of intermetallic compound (IMC) growth on the
adhesive strength of solder joints. 100Sn and 60Sn40Pb solders were used to solder …

Using the high defect density Cu (HD 2 Cu), successful Cu-Cu direct bonding was obtained
at low temperature, 240° C. In our previous research, the self-annealing mechanical …

This paper presents the effects of diamond nanoparticles reinforcement on lead-free SAC
305 solder paste after the reflow soldering process. Different diamond nanoparticles …

The reuse potential of SnPb-solder affected old/waste copper is investigated under the
influence of work hardening and thermal treatments. In fact, the urge of using old copper to …

Tensile testing was carried out at constant cross-head speed of 0.5 mm/min on specimens of
two Cu blocks of length 45mm with rectangular area of cross-section (10 mm× 3 mm) …

The effect of Cu-Sn intermetallic compounds (IMC) on the fatigue failure of solder joints has
been studied by means of shear cycling. The samples consist of leadless ceramic chip …

Purpose–This paper aims to establish a method to optimize reflow profiles and achieve high
reliability of solder joints on the basis of the heating factor, Q η, a measure of the reflow …

Purpose–This paper aims to offer a convenient method to develop an oven recipe for a
specific soldering profile in a reflow process. The method is devised to quickly achieve …

Fatigue crack growth (FCG) behavior along 63Sn–37Pb solder/copper interface was
investigated using a solder-jointed plate specimen with a single-edge crack under opening …