3-D integration and through-silicon vias in MEMS and microsensors

Z Wang - Journal of Microelectromechanical Systems, 2015 - ieeexplore.ieee.org
After two decades of intensive development, 3-D integration has proven invaluable for
allowing integrated circuits to adhere to Moore's Law without needing to continuously shrink …

Surface tension-driven self-alignment

M Mastrangeli, Q Zhou, V Sariola, P Lambert - Soft Matter, 2017 - pubs.rsc.org
Surface tension-driven self-alignment is a passive and highly-accurate positioning
mechanism that can significantly simplify and enhance the construction of advanced …

Wafer-to-wafer alignment for three-dimensional integration: A review

SH Lee, KN Chen, JJQ Lu - Journal of Microelectromechanical …, 2011 - ieeexplore.ieee.org
This paper presents a review of the wafer-to-wafer alignment used for 3-D integration. This
technology is an important manufacturing technique for advanced microelectronics and …

Hybrid microassembly combining robotics and water droplet self-alignment

V Sariola, M Jääskeläinen… - IEEE transactions on …, 2010 - ieeexplore.ieee.org
This paper reports an in-depth study of a hybrid microassembly technique that combines a
robotic micromanipulator and a water droplet self-alignment, which greatly improves the …

Effect of contact angle and contact angle hysteresis on the floatability of spheres at the air-water interface

D Feng, AV Nguyen - Advances in colloid and interface science, 2017 - Elsevier
The floatability of solid particles on the water surface governs many natural phenomena and
industrial processes including film flotation and froth flotation separation of coal and …

Circular dielectric liquid iris

CG Tsai, JA Yeh - Optics letters, 2010 - opg.optica.org
We demonstrate a liquid iris diaphragm using dielectric force, enabling its aperture to vary
from 4mm at the resting state to 1.5 mm at 160V_rms. The liquid iris is a packaged optical …

The effect of solder paste volume on solder joint shape and self-alignment of passive components

K Pan, JH Ha, H Wang, J Xu… - 2020 IEEE 70th …, 2020 - ieeexplore.ieee.org
In this study, an energy-based three-dimensional (3D) model is created using Surface
Evolver to predict the passive components solder joint shape after reflow soldering. The …

Lateral and normal capillary force evolution of a reciprocating liquid bridge

Q Song, K Liu, W Sun, R Chen, J Ji, Y Jiao, T Gao… - Langmuir, 2021 - ACS Publications
Capillary forces of a shearing liquid bridge can significantly affect the friction and adhesion
of interacting surfaces, but the underlying mechanisms remain unclear. We custom built a …

Modelling the self-alignment of passive chip components during reflow soldering

O Krammer - Microelectronics Reliability, 2014 - Elsevier
In my research a 3D model was created to investigate the restoring force arising and the self-
alignment occurring during reflow soldering; and simulations were performed to examine the …

A tearable dissolving microneedle system for shortening application time

WJ Lee, MR Han, JS Kim, JH Park - Expert Opinion on Drug …, 2019 - Taylor & Francis
Objectives: A tearable dissolving microneedle system (TD-MN system) was developed for
shortening the time required to administer drugs into the skin through the dissolving …