We propose new 3D 2‐layer and 3‐layer NoC architectures that utilize homogeneous
regular mesh networks on a separate layer and one or two heterogeneous floorplanning …

In this paper, we describe the architecture and implementation of 3D multiprocessor with 3D
NoC. The 2 tiers design is based on 16 processors communicating using a 4× 2 mesh NoC …

3D Conception is an efficient solution to deal with the global wiring delay which is
overcoming the gates delay in nanometres CMOS technology. We present in this paper, the …

In this paper, we propose a new 2.5 D NoC architecture that uses a homogeneous network
on one layer on top of a heterogeneous floorplanning layer. The purpose of this approach is …

In this paper we present a technique for implementing a fine-grain partitioned three-
dimensional SAR DSP system using 3D placement of standard cells where only one of the …

Networks-on-chip have been developed in the last few years to address the scalability
challenges of global on-chip communication. VLSI technology is now rapidly moving into …

Embodiments of the invention relate to processor arrays, and in particular, a processor array
with interconnect circuits for bonding semiconductor dies. One embodiment comprises …

Embodiments of the invention relate to an array of processor core circuits with reversible
tiers. One embodiment com prises multiple tiers of core circuits and multiple Switches for …

When designing 3DICs there are five major issues that differ from 2D that must receive
special attention: power delivery, thermal density, design for test, clock tree design and …

Research in 3D integration has been attracted researchers from industries as well as
academics due to its superior benefits over 2D architecture such as better performance …