Additives are a cost-effective method to improve the performance of the very low profile
(HVLP) copper foil coarsened layer. In this paper, the effects of 3, 3'-Dithiobis-1 …

In high‐frequency printed circuit boards (PCBs), there is an inherent contradiction between
minimizing signal loss and maximizing adhesion strength. To tackle this issue, this work …

In this paper, the directional growth behavior of Sn whiskers was found to be associated with
the interfacial γ-Ag 2 Al IMCs at Sn-3.5 Ag/Al interface. A 100 μm thick columnar structured …

The inhibitory effect of molecular weight (Mw) of polyethylene glycol (PEG) on the through-
hole filling by copper electroplating was investigated by the electrochemical testing method …

In order to enhance the electrolytic copper foil-epoxy adhesion in copper clad laminates,
surface modification of the copper foil with a proper coupling agent is essential. However …

A novel method for coating basalt fiber with a eutectic bismuth–tin (Bi–Sn) mixture was
developed. Bi-Sn nanoparticles were synthesized using a sol-gel process and deposited on …

Low-dielectric polymers face prominent development challenges at high frequency.
Particularly, the relationship between the high-frequency dielectric loss and polymer …

In this experiment, two similar molecules with bifunctional groups have been characterized
to prove the advantages of dual-anchor molecular coating in the interfacial modification of …

This study explores the impact of the electroplating additive JGB the surface characteristics
and peel strength of electrolytic copper foils used in printed circuit boards. Utilizing Scanning …

Abstract A series of 1, 8-naphthalimide derivatives containing different quaternary
ammonium groups have been synthesized by a two-step method. Electrochemical tests and …