The phenomenon of bifurcation significantly impacts the warpage in wafers and
consequently the yield and reliability of final systems in packages (SiPs). In this work, an …

A technological platform is established for scalable flexible hybrid electronics based on a
novel fan-out wafer-level packaging (FOWLP) methodology. Small dielets are embedded in …

The Stoney formula is widely used to obtain residual stress in films on isotropic circular
plates. However, in the case of large deformations, this formula produces significant errors …

Many wind-induced collapse events of super-large cooling tower have been taken place in
history. Existing norms are limited within local excessive strength or buckling failure of the …

The successful handling of large semiconductor wafers is crucial for scaling up their
production. Early-stage warpage control allows the prevention of undesirable asymmetric …

In this work we report a relationship between the curvature provided by the Stoney equation,
considered in an" extended" linear regime, and the arithmetic average of the main …

Bifurcation is a non-linear phenomenon which determines the emergence of an abrupt
degeneration in the symmetry of large wafers undergoing the large-scale integration …

Handling and warpage control of larger and thinner semiconductor wafers can be critical
within the large-scale semiconductor manufacturing process. With the development of 8” …

A thin subsurface damage layer is often formed in the ground layer of a silicon wafer.
Compressive stresses exist in the damage layer of the wafer and cause the wafer to deflect …

Scaling up the production of power devices involves, in the semiconductor industry, the use
of large semiconductor 8” and 12” wafers of Si or SiC. Their use implicates a successful an …