Ultrafast laser applications in manufacturing processes: A state-of-the-art review

S Lei, X Zhao, X Yu, A Hu… - Journal of …, 2020 - asmedigitalcollection.asme.org
With the invention of chirped pulse amplification for lasers in the mid-1980s, high power
ultrafast lasers entered into the world as a disruptive tool, with potential impact on a broad …

Laser-induced joining of nanoscale materials: processing, properties, and applications

M Xiao, S Zheng, D Shen, WW Duley, YN Zhou - Nano Today, 2020 - Elsevier
The rapid development of flexible and wearable nanodevices for a variety of commercial
applications has identified a pressing need for targeted research on nanomaterials for use …

Joining of silver nanomaterials at low temperatures: processes, properties, and applications

P Peng, A Hu, AP Gerlich, G Zou, L Liu… - ACS applied materials …, 2015 - ACS Publications
A review is provided, which first considers low-temperature diffusion bonding with silver
nanomaterials as filler materials via thermal sintering for microelectronic applications, and …

Poly (vinyl alcohol) as a water protecting agent for silver nanoparticles: The role of polymer size and structure

A Kyrychenko, DA Pasko, ON Kalugin - Physical Chemistry Chemical …, 2017 - pubs.rsc.org
Chemical modification of silver nanoparticles (AgNPs) with a stabilizing agent, such as poly
(vinyl alcohol)(PVA), plays an important role in shape-controlled seeded-growth and …

Robust Ag nanoplate ink for flexible electronics packaging

RZ Li, A Hu, D Bridges, T Zhang, KD Oakes, R Peng… - Nanoscale, 2015 - pubs.rsc.org
Nanoinks are currently a topic of heightened interest with respect to low temperature
bonding processes and printable electronics. We have developed an innovative …

Geometrical effects on sintering dynamics of Cu–Ag core–shell nanoparticles

J Wang, S Shin, A Hu - The Journal of Physical Chemistry C, 2016 - ACS Publications
Understanding of the nanoparticle (NP) sintering mechanism at the atomic scale is of
significance for improving various NP applications, such as printable nanoinks, catalysts …

Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications

B Meschi Amoli, A Hu, NY Zhou, B Zhao - Journal of Materials Science …, 2015 - Springer
During the last two decades, considerable efforts have been made to explore new
generations of interconnecting materials and printed lines to replace the traditionally used …

Highly electrically conductive adhesives using silver nanoparticle (Ag NP)-decorated graphene: The effect of NPs sintering on the electrical conductivity improvement

B Meschi Amoli, J Trinidad, A Hu, YN Zhou… - Journal of Materials …, 2015 - Springer
Electrically conductive adhesives (ECAs) filled with silver nanoparticle (Ag NP)-decorated
graphene were prepared and the effect of curing temperature on the electrical conductivity of …

Structural evaluation and deformation features of interface of joint between nano-crystalline Fe–Ni–Cr alloy and nano-crystalline Ni during creep process

S Pal, M Meraj - Materials & design, 2016 - Elsevier
A molecular dynamic (MD) simulation has been performed to study the creep behavior and
structural evaluation during creep process of nano-joint of nano-crystalline (NC) Ni and Fe …

Molecular dynamics simulation of the size-dependent morphological stability of cubic shape silver nanoparticles

MM Blazhynska, A Kyrychenko, ON Kalugin - Molecular simulation, 2018 - Taylor & Francis
The morphological stability of sharp-edged silver nanoparticles is examined by the classical
molecular dynamics (MD) simulations. The crystalline structure and the perfect fcc atom …