Ni-30wt% Sn alloy powder beds were remelted using a laser beam to examine regular
eutectic and anomalous eutectic growth behavior. The remelted microstructure mainly …

The present study investigates the effects of Al content and solidification thermal parameters
on the microstructural development under transient heat flow conditions for two …

Due to the rising demand for thermal management technologies within the electronics
industry, there has been an increased emphasis on developing new thermal interface …

Bi–Ag lead-free alloys are considered interesting alternatives to Pb-based traditional solders
due to compatible melting point and strength. During soldering, the ability of a liquid alloy to …

With the increasing interest in developing Al-Cu-Ni alloys for use as structural material
comes the need to understand more about their processing–microstructure–properties …

The aim of the present study is to investigate the thermal behavior, microstructure and
mechanical properties of high temperature Zn–30Sn–2Cu–x Ce (x= 0, 0.05, 0.1, 0.5 wt%) Pb …

Abstract Zn–30Sn–2Cu–0.5 Ni–0.2 Al (ZnSnCuNiAl) solder joints were isothermally aged in
the temperature range of 100–170° C for up to 360 h, and the growth behavior and kinetics …

Purpose This study aims to study the impact of intermetallic compound on microstructure,
mechanical characteristics and thermal behavior of the melt-spun Bi-Ag high-temperature …

Directionally solidified samples of an Fe‐Fe3C white eutectic alloy were produced in a
vacuum Bridgman‐type furnace to study their eutectic growth with pulling rates of 300, 450 …

High-temperature lead-free Bi–11Ag solder with a Sn addition of 1, 3, and 5 wt% was
investigated in this paper. The results show that the melting temperature of Bi–11Ag solders …