Influences of mono-Ni (P) and dual-Cu/Ni (P) plating on the interfacial microstructure evolution of solder joints
Z Zhang, X Hu, X Jiang, Y Li - Metallurgical and Materials Transactions A, 2019 - Springer
The interfacial microstructures of Sn-3.0 Ag-0.5 Cu (SAC305) solder systems with thin Ni (P)
mono-coatings and Cu-Ni (P) dual-coatings were investigated after reflowing and isothermal …
mono-coatings and Cu-Ni (P) dual-coatings were investigated after reflowing and isothermal …
Analysis of leaching chemicals from solder mask and effect on electroless Ni (P) plating
ZY Yu, CY Wu, KL Fu, JS Chang, TH Yen… - Journal of Materials …, 2025 - Springer
In this work, the effect of solder mask leaching on the electroless Ni (P) plating process was
investigated. We found that the chemical leaching promotes the density of the nucleation …
investigated. We found that the chemical leaching promotes the density of the nucleation …
2-Mercaptobenzimidazole, 2-Mercaptobenzothiazole, and Thioglycolic Acid as Additives for Electrolytic Ni Plating
AO Gezerman, BD Çorbacıoğlu - Iranian Journal of Science and …, 2018 - Springer
Abstract In this study, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, and thioglycolic
acid were used as additives in the nickel electroplating bath to improve the physical …
acid were used as additives in the nickel electroplating bath to improve the physical …