The ocean environment has enormous uncertainty due to the influence of complex waves
and undercurrents. The human beings are limited in their abilities to detect and utilize …

This work reviewed different three-dimensional viscoelastic models, including Hooke,
Newton, Maxwell, Voigt, Boltzmann, Zener, Tsay, Burgers, Weichert, and Kelvin models. The …

The creep and fatigue properties of 95.5 Sn-3.8 Ag-0.7 Cu lead free solders were
investigated. Steady-state creep behavior for 95.5 Sn-3.8 Ag-0.7 Cu bulk solder specimens …

An improved Anand constitutive model is proposed to describe the inelastic deformation of
lead-free solder Sn-3.5 Ag used in solder joints of microelectronic packaging. The new …

The uniaxial tensile inelastic deformation behavior for three types of lead-free solders, Sn–
3Ag–0.5 Cu, Sn–3.5 Ag and Sn–0.7 Cu, were simulated by a unified viscoplastic constitutive …

Sn–Pb eutectic alloy is widely applied to the deep-space electronics that work under
cryogenic environments, but little is known about its responses to the mechanical loading at …

As a potential alternative to conventional solders and adhesive films, low-temperature
sintered nano-silver paste, as a result of its high thermal and electrical conductivity …

Thermal performance of a chip-scale packaged power device can be improved by attaching
a heat spreader to the backside of the heat generating silicon die via solder thermal …

Abstract The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run
3, uses silicon microchannel coolers with internally circulating bi-phase CO 2 for thermal …

Most solders used in electronic systems have low-melting temperature and hence
experience significant amount of creep deformation throughout their life-cycle because …