Techniques for distribution of optical signals, both free space and guided, within electronic
systems has been extensively investigated over more than a decade. Particularly at the …

The purpose of this paper is to review the recent progress in the developing smart pixel
technologies. The paper begins by reviewing some of the rapidly evolving smart pixel …

The multimaterial integration of thin-film optoelectronic devices with host substrates ranging
from silicon circuits to glass waveguides to polymer micromachines offers to the system …

The current dominance of and large markets for silicon electronics can no longer justify the
use of complex compound semiconductor electronic circuits on the basis of the need for …

Smart pixel architectures offer important new opportunities for low-cost, portable image
processing systems. They provide greater I/O bandwidth and computing performance than …

We present theoretical and experimental results on monolithically integrated through-the-
substrate input/output vertical-cavity lasers (VCLs) and resonant photodetectors that are …

The integration of thin film optoelectronic devices with host substrates such as circuits,
waveguides, and micromachines offers to the systems engineer the freedom to choose the …

This paper describes Pica, a fine-grain, message-passing architecture designed to efficiently
support high-throughput, low-memory parallel applications, such as image processing …

Three-dimensional packaging technologies are critical for enabling ultra-compact, massively
parallel processors (MPPs) for embedded applications. Through-water optical interconnect …

We present for the first time a three-dimensional (3D) Si CMOS interconnection system
consisting of three layers of optically interconnected hybrid integrated Si CMOS transceivers …