Electronic products are evolving towards miniaturization, high integration, and multi-function,
which undoubtedly puts forward higher requirements for the reliability of solder joints in …

The quantity and variety of parameters involved in the failure evolutions in solder joints
under a thermo-mechanical process directs the reliability assessment of electronic devices …

In the service of electronic products, owing to thermal cycling and external additional loads,
solder joints undergo thermomechanical coupled cyclic loading. To fully understand the …

Applications under extreme conditions, such as solid circuit breakers and electromagnetic
launching systems, are great challenges to semiconductor power devices. The die-attach …

This article deals with the effects of creep failure mechanism on thermomechanical reliability
of power semiconductors. Regarding power semiconductors' working conditions, fatigue and …

Rapid reliability analysis of the solder joints in the electronic devices identifies as an
appeared gap in the design stage. This paper demonstrates the feasibility of employing the …

In this work, we show that how solder thickness can affect the IGBTs' useful lifetime. Hence,
the thermo-mechanical response of joints in IGBT discrete with different solder thickness …

Solder degradation is one of the main packaging failure modes in insulated gate bipolar
transistor (IGBT) modules, which is usually evaluated through the change of thermal …

In this paper, long short-term memory (LSTM) networks are used in an original way to model
the behavior of a viscoplastic material solicited under changing loading conditions. The …

High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip
technology have become one of the most promising light sources. The die attach solder …