Influence of superimposed ultrasound on deformability of Cu
The effects of superimposed ultrasonic vibration on the plastic deformation of 99.99% pure
polycrystalline Cu are studied both during (temporary) and after (residual) the application of …
polycrystalline Cu are studied both during (temporary) and after (residual) the application of …
Effects of superimposed ultrasound on deformation of gold
The effects of superimposed ultrasound vibration on plastic deformation of gold are studied
both during and after the vibration using an ultrasonic ball bonding machine. It is found that …
both during and after the vibration using an ultrasonic ball bonding machine. It is found that …
Development and status of Cu ball/wedge bonding in 2012
M Schneider-Ramelow, U Geißler, S Schmitz… - Journal of electronic …, 2013 - Springer
Starting in the 1980s and continuing right into the last decade, a great deal of research has
been published on Cu ball/wedge (Cu B/W) wire bonding. Despite this, the technology has …
been published on Cu ball/wedge (Cu B/W) wire bonding. Despite this, the technology has …
[HTML][HTML] Fine pitch copper wire bonding in high volume production
BK Appelt, A Tseng, CH Chen, YS Lai - Microelectronics Reliability, 2011 - Elsevier
Wire bonding is the predominant mode of interconnection in electronic packaging. Gold wire
bonding has been refined again and again to retain control of interconnect technology due …
bonding has been refined again and again to retain control of interconnect technology due …
Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force
Cu bonding wire is more and more used for interconnections to integrated circuits (ICs) to
reduce cost and increase performance compared to Au wire. To eliminate underpad …
reduce cost and increase performance compared to Au wire. To eliminate underpad …
Simulation of wire bonding process using explicit FEM with ALE remeshing technology
CC Yang, YF Su, SY Liang, KN Chiang - Journal of Mechanics, 2020 - cambridge.org
Thermosonic wire bonding is a common fabrication process for connecting devices in
electronic packaging. However, when the free air ball (FAB) is compressed onto the I/O pad …
electronic packaging. However, when the free air ball (FAB) is compressed onto the I/O pad …
Low cost Pd coated Ag bonding wire for high quality FAB in air
S Tanna, JL Pisigan, WH Song, C Halmo… - 2012 IEEE 62nd …, 2012 - ieeexplore.ieee.org
A 25 μm diameter Ag wire is coated with a nano-layer of Pd to form a Palladium coated
Silver bonding wire (PCS). A new method is used in which the coating is directly attached to …
Silver bonding wire (PCS). A new method is used in which the coating is directly attached to …
Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding
Abstract Effects of the electrical flame off (EFO) parameters on the hardness and work
hardening properties of Cu free air balls (FABs) are reported and compared to those of Au …
hardening properties of Cu free air balls (FABs) are reported and compared to those of Au …
[HTML][HTML] Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding
The development of novel Cu wires for thermosonic wire bonding is time consuming and the
effects of shielding gas on the electrical flame off (EFO) process is not fully understood. An …
effects of shielding gas on the electrical flame off (EFO) process is not fully understood. An …
In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal
A method is developed using an ultrasonic wire bonder to systematically study in situ the
effect of superimposed ultrasound during deformation on the residual hardness of a metal …
effect of superimposed ultrasound during deformation on the residual hardness of a metal …