Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such
as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF) …

Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …

Poor high/medium-temperature phase stability and/or low room-temperature ductility are
currently bottlenecks of refractory high-entropy alloys (RHEAs) that restrict their high …

Sn coatings were electrodeposited over mild steel at different current densities (5 mA cm− 2,
20 mA cm− 2, 40 mA cm− 2, 60 mA cm− 2, and 80 mA cm− 2). Corrosion resistance was …

Technological advancements and the emphasis on reducing the use of hazardous
materials, such as Pb, have led to the widely use of Sn-based Pb-free solder in advanced …

Electromigration (EM) causes intermetallic and void growth that decreases the reliability and
lifetime of solder joints. As a diffusion-controlled process, EM is highly dependent on the …

Abstract Eutectic Ag3Sn can grow with a variety of morphologies depending on the
solidification conditions and plays an important role in the performance of Pb-free solders …

Graphene as a reinforcement is expected to improve the shear strength of solder joint.
However, little is known about the deformation behavior and mechanisms of composite …

Though Ga is a promising addition used in third-generation lead-free solders for harsh-
environment applications, its influences on βSn structure and mechanical properties of …

Thermal fatigue is a common failure mode in electronic solder joints, yet the role of
microstructure is incompletely understood. Here, we quantify the evolution of microstructure …