Electronic devices generate heat during operation and require efficient thermal
management to extend the lifetime and prevent performance degradation. Featured by its …

With the ever-increasing development of 5G technology, high signal propagation loss and
high heating flux in miniaturizing devices bring about simultaneous and urgent requirement …

To attain the high dispersion and strong interfacial bonding of TiO 2 in fluororubber (FKM), a
novel “core–shell” structured SiO 2@ TiO 2 nanofillers was designed and synthesized by in …

To enhance thermal dissipation from packaged electronic components, a material with high
thermal conductivity and low coefficient thermal expansion is required. In this work, a …

The spatial confining forced network assembly (SCFNA) has proven to be a promising
method for greatly improving the thermal conductivity (TC) of polymer composites via …

In the preparation of thermally conductive polymer composites (TCPC), it is necessary to
incorporate a filler network in the polymer matrix. Further enhancement of the thermal …

Boron nitride has been widely utilized as a filler to increase the thermal conductivity of
polymers due to its unique features, such as electrical insulation, high thermal conductivity …

Carbon fiber-reinforced polymer-matrix composites have been an important research topic
due to their high performance and versatility. In this study, we investigated the mechanical …

As modern electronics advance toward miniaturization and integration, there is an increased
demand for effective thermal management solutions. One of the most promising strategies to …

Technological progress encourages the development of more versatile electronic devices
with reduced size at an increasing rate. Thermosets epoxy is a popularly preferred adhesive …