MeSiti PC (57) ABSTRACT Apparatus and method are provided for facilitating cooling of an
electronic component. The apparatus includes a liquid cooled structure, athermal …

Cooling apparatuses and coolant-cooled electronic systems are provided which include
thermal transfer structures con figured to engage with a spring force one or more electronics …

5,794.454 5,829,516 6,263,959 6,411,512 6,434,000 6,480,014 6,548,894 6,557,354
6,775,137 6,934,118 7,002,799 7,151,668 7,221,569 7,233,501 7,273,090 7,286,355 …

A memory module cooling system includes a liquid cooled manifold assembly and a heat
spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis …

(57) ABSTRACT A system to aid in cooling an in-line memory module may include a heat
spreader including a channel to accommodate the in-line memory module, thermal interface …

MeSiti PC (57) ABSTRACT Apparatus and method are provided for facilitating cooling of an
electronic component. The apparatus includes a liquid cooled cold plate and a thermal …

BACKGROUND Conventional server storage units include hard-drive based or similar
storage devices. While hard-drives are cheap, the physical size of the hard-drives and the …

An integrated circuit (IC) can be cooled by using a structure that includes two elements, such
as integrated circuits (ICs) or electronic packages, in a stacked arrangement, with the …

A cooling module row for an inline-memory module is provided. The cooling module row
may include an inlet chamber and an outlet chamber positioned at a same end of the …

Cooling apparatuses and coolant-cooled electronic assem blies are provided which include
a thermal transfer structure configured to couple to one or more sides of an electronics card …