The reliability of semiconductor materials with electrical and optical properties are
connected to their structures. The elastic strain field and tilt analysis of the crystal lattice …

Atomistic-based multiscale and molecular dynamics modeling are powerful tools to simulate
the localized strain problems, offering tremendous opportunities to bridge the knowledge …

In recent years, elliptical vibration cutting (EVC) has become a promising technique to
fabricate high quality surface of single-crystal silicon. However, our understanding for its …

In this research, we performed molecular dynamics (MD) simulation to investigate the
material removal mechanism and subsurface damage formation during nano-scratching of …

Metal-semiconductor nanostructures are key objects for multifunctional electronics and
optical design. We report a new interatomic potential for atomistic simulation of a ternary Si …

Subsurface damage that is caused by mechanical machining is a major impediment to the
widespread use of hard–brittle materials. Ultrasonic vibration-assisted macro-or …

The ion beam polishing techniques for silicon wafers play a key role in the fabrication of
optical element. However, the dynamical ion beam polishing process at nanoscale time and …

Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical
stage in solar cell manufacturing. In order to improve the production yield of the cutting …

This paper proposes an analytical model for predicting grinding-induced sub-surface
damage depth in a silicon wafer. The model integrates the dislocation kinetics for crack …

Molecular dynamics (MD) were utilized to explore the damage of gallium nitride (GaN) in
nanogrinding at a wide range of initial temperature (100–1000 K). The focus is on the …