With the continuous reduction of chip feature size, the continuation of Moore's Law becomes
increasingly difficult and heterogeneous integration has become one of the important …

Self-assembled monolayer (SAM) of 1-hexanethiol is applied on copper (Cu) surface to
retard surface oxidation during exposure in the ambient. This SAM layer can be desorbed …

5-Methoxy-2-(octadecylthio) benzimidazole (MOTBI) monolayer was self-assembled on
fresh copper surface obtained after etching with nitric acid at ambient temperature. The …

Cu-Cu direct interconnects are highly desirable for the microelectronic industry as they allow
for significant reductions in the size and spacing of microcontacts. The main challenge …

Self-assembled monolayer (SAM) of alkane-thiol is formed on copper (Cu) thin layer coated
on silicon (Si) wafer with the aim to protect the surface against excessive oxidation during …

Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is
of great interest due to their low-temperature processing and compatibility with substrates for …

Sintering of nano Ag paste on bare Cu has attracted more interests recently for high-
temperature electronics packaging, which offers the advantages of high reliability, cost …

Wetting balance tests of copper sheets submerged in tin solder baths were carried out in a
completely automatic wetting balance. Wetting curves were examined for three different …

A novel pretreatment of plasma combined self-assembled monolayer (PcSAM) was
proposed to improve surface properties of electroplated Cu for low temperature Cu–Sn …

Isotropically conductive adhesives (ICAs) and inks are seen as suitable candidates for
interconnecting components and for printed circuits. Silver (Ag) filled ICAs and inks are the …