[PDF][PDF] High-speed visible light communication based on micro-LED: A technology with wide applications in next generation communication

T Lu, X Lin, W Guo, CC Tu, S Liu, CJ Lin… - Opto-Electronic …, 2022 - researching.cn
The evolution of next-generation cellular networks is aimed at creating faster, more reliable
solutions. Both the next-generation 6G network and the metaverse require high transmission …

High-performance GaN vertical fin power transistors on bulk GaN substrates

M Sun, Y Zhang, X Gao… - IEEE Electron Device …, 2017 - ieeexplore.ieee.org
This letter reports a GaN vertical fin power field-effect-transistor structure with submicron fin-
shaped channels on bulk GaN substrates. In this vertical transistor design only n-GaN layers …

Multi-channel nanowire devices for efficient power conversion

L Nela, J Ma, C Erine, P Xiang, TH Shen, V Tileli… - Nature …, 2021 - nature.com
Nanowire-based devices can potentially be of use in a variety of electronic applications,
from ultrascaled digital circuits to 5G communication networks. However, the devices are …

Impact of the surface recombination on InGaN/GaN-based blue micro-light emitting diodes

J Kou, CC Shen, H Shao, J Che, X Hou, C Chu… - Optics express, 2019 - opg.optica.org
In this work, the size-dependent effect for InGaN/GaN-based blue micro-light emitting diodes
(µLEDs) is numerically investigated. Our results show that the external quantum efficiency …

Dynamic on-resistance in GaN power devices: Mechanisms, characterizations, and modeling

S Yang, S Han, K Sheng… - IEEE Journal of Emerging …, 2019 - ieeexplore.ieee.org
Gallium nitride (GaN) power devices enable power electronic systems with enhanced power
density and efficiency. Dynamic on-resistance (R ON) degradation (or current collapse) …

[图书][B] Gallium nitride and silicon carbide power devices

BJ Baliga - 2016 - books.google.com
During the last 30 years, significant progress has been made to improve our understanding
of gallium nitride and silicon carbide device structures, resulting in experimental …

Characterization of interface states in Al2O3/AlGaN/GaN structures for improved performance of high-electron-mobility transistors

Y Hori, Z Yatabe, T Hashizume - Journal of Applied Physics, 2013 - pubs.aip.org
We have investigated the relationship between improved electrical properties of Al 2 O
3/AlGaN/GaN metal-oxide-semiconductor high-electron-mobility transistors (MOS-HEMTs) …

Ultrathin-barrier AlGaN/GaN heterostructure: A recess-free technology for manufacturing high-performance GaN-on-Si power devices

S Huang, X Liu, X Wang, X Kang… - … on Electron Devices, 2017 - ieeexplore.ieee.org
(Al) GaN recess-free normally OFF technology is developed for fabrication of high-yield
lateral GaN-based power devices. The recess-free process is achieved by an ultrathin …

Breakdown enhancement and current collapse suppression by high-resistivity GaN cap layer in normally-off AlGaN/GaN HEMTs

R Hao, W Li, K Fu, G Yu, L Song, J Yuan… - IEEE Electron …, 2017 - ieeexplore.ieee.org
In this letter, a device structure of high-resistivity-cap-layer HEMT (HRCL-HEMT) is
developed for normally-off p-GaN gate HEMT toward high breakdown voltage and low …

N-polar GaN HEMTs exhibiting record breakdown voltage over 2000 V and low dynamic on-resistance

OS Koksaldi, J Haller, H Li… - IEEE Electron …, 2018 - ieeexplore.ieee.org
Nitrogen polar (N-Polar) GaN high-electron-mobility transistors (HEMT) targeting high-
voltage switching applications were fabricated on epi-layers grown by metal-organic …