Living radical polymerization by the RAFT process

G Moad, E Rizzardo, SH Thang - Australian journal of chemistry, 2005 - CSIRO Publishing
This paper presents a review of living radical polymerization achieved with thiocarbonylthio
compounds [ZC (= S) SR] by a mechanism of reversible addition–fragmentation chain …

Nanoporous polymeric materials: A new class of materials with enhanced properties

B Notario, J Pinto, MA Rodriguez-Perez - Progress in Materials Science, 2016 - Elsevier
Nanoporous polymeric materials are porous materials with pore sizes in the nanometer
range (ie, below 200 nm), processed as bulk or film materials, and from a wide set of …

Building nanostructures using RAFT polymerization

C Boyer, MH Stenzel, TP Davis - Journal of Polymer Science …, 2011 - Wiley Online Library
Reversible addition fragmentation chain transfer (RAFT) polymerization is one of the most
extensively studied controlled/living radical polymerization methods that has been used to …

Experimental Requirements for an Efficient Control of Free‐Radical Polymerizations via the Reversible Addition‐Fragmentation Chain Transfer (RAFT) Process

A Favier, MT Charreyre - Macromolecular Rapid …, 2006 - Wiley Online Library
Reversible addition‐fragmentation chain transfer (RAFT) polymerization is a recent and very
versatile controlled radical polymerization technique that has enabled the synthesis of a …

Mesoporous Polyimide Thin Films as Dendrite-Suppressing Separators for Lithium–Metal Batteries

D Guo, L Mu, F Lin, G Liu - ACS nano, 2023 - ACS Publications
Lithium–metal batteries require the effective suppression of lithium dendrites to guarantee
both high performance and safety. Today's separators have macropores allowing lithium …

Hyperbranched polysiloxane (HBPSi)-based polyimide films with ultralow dielectric permittivity, desirable mechanical and thermal properties

X Lei, Y Chen, M Qiao, L Tian, Q Zhang - Journal of Materials …, 2016 - pubs.rsc.org
Low-dielectric polyimide (PI) is on high demand in the next generation of high-density and
high-speed integrated circuits. The introduction of fluorine or pores into PIs has been …

Novel low-κ polyimide/mesoporous silica composite films: Preparation, microstructure, and properties

J Lin, X Wang - Polymer, 2007 - Elsevier
A series of novel low-dielectric constant (low-κ) polyimide (PI) composite films containing the
SBA-15 or the SBA-16-type mesoporous silica were successfully prepared via in situ …

Novel soluble polyimides containing pyridine and fluorinated units: preparation, characterization, and optical and dielectric properties

W Dong, Y Guan, D Shang - Rsc Advances, 2016 - pubs.rsc.org
To acquire low dielectric constant polyimide films with good mechanical and thermal
properties and low coefficient of thermal expansion (CTE) applied in microelectronic fields …

Imprinting well-controlled closed-nanopores in spin-on polymeric dielectric thin films

M Ree, J Yoon, K Heo - Journal of Materials Chemistry, 2006 - pubs.rsc.org
The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated
circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation …

Synthesis and properties of low‐dielectric‐constant polyimides with introduced reactive fluorine polyhedral oligomeric silsesquioxanes

YS Ye, WY Chen, YZ Wang - Journal of Polymer Science Part A …, 2006 - Wiley Online Library
A high‐performance, low‐dielectric‐constant polyimide (PI) nanocomposite from poly (amic
acid)(PAA) cured with a reactive fluorine polyhedral oligomeric silsesquioxane (POSS) …