Review of ultrasonic-assisted soldering in Sn-based solder alloys
C Chen, L Zhang, X Wang, X Lu, L Gao, M Zhao… - Journal of Materials …, 2023 - Springer
Sn-based lead-free solder has been widely applied in areas like electronic packaging due to
its excellent solderability. The composite solders can be obtained by mixing additional …
its excellent solderability. The composite solders can be obtained by mixing additional …
A review on the development of adding graphene to Sn-based lead-free solder
Y Li, S Yu, L Li, S Song, W Qin, D Qi, W Yang, Y Zhan - Metals, 2023 - mdpi.com
In the electronics industry, graphene is applied with modified lead-free solder. This review
presents advances in the preparation, strengthening mechanisms, and property …
presents advances in the preparation, strengthening mechanisms, and property …
Preparation, characterization and mechanical properties analysis of SAC305-SnBi-Co hybrid solder joints for package-on-package technology
S Zhang, X Jing, J Chen, KW Paik, P He… - Materials …, 2024 - Elsevier
The development of hybrid solder for chip packing is a major 3D packaging research topic.
The incorporation of with low melting points into solder materials has been used in low …
The incorporation of with low melting points into solder materials has been used in low …
[HTML][HTML] Microstructure and properties of Sn58Bi/Ni solder joint modified by Mg particles
C Chen, L Zhang, X Wang, X Lu, Y Guo - Journal of Materials Research …, 2023 - Elsevier
In this paper, various mass fractions (0, 0.1, 0.2, 0.4, 0.6, 0.8 wt%) of Mg particles were
added to the Sn58Bi solder to achieve the purpose of modification, through which the Ni …
added to the Sn58Bi solder to achieve the purpose of modification, through which the Ni …
Role of crystallographic orientation of β-Sn grain on electromigration failures in lead-free solder joint: An overview
Due to the miniaturization of electronic devices, electromigration became one of the serious
reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an …
reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an …
Improved microstructure and strength of Sn-Ag-Cu/Cu solder joint with Mo nanoparticles addition
S Ma, L Yang, J Yang, Y Liang - Materials Letters, 2024 - Elsevier
A new type of lead-free composite solder has been prepared by adding Mo nanoparticles in
Sn3. 0Ag0. 5Cu solder. Tensile strength tests were conducted on Sn3. 0Ag0. 5Cu/Cu joint …
Sn3. 0Ag0. 5Cu solder. Tensile strength tests were conducted on Sn3. 0Ag0. 5Cu/Cu joint …
Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint
Downscaling of electronic devices increased the current density in the solder joint. High
current density causes the rapid diffusion of Cu atoms which is the root cause of failure in …
current density causes the rapid diffusion of Cu atoms which is the root cause of failure in …
Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint
Abstract Eutectic Sn–Bi alloy is acquiring significant observation in the electronic packaging
industry because of its advantageous properties such as ductility, low melting temperature …
industry because of its advantageous properties such as ductility, low melting temperature …
Microstructure and properties of electromigration of Sn58Bi/Cu solder joints with different joule thermal properties
Y Gao, K Zhang, C Zhang, Y Wang, W Chen - Metals, 2023 - mdpi.com
Electromigration is one of the most important research issues affecting the reliability of
solder joints. Current-induced Joule heating affects the electromigration behavior of solder …
solder joints. Current-induced Joule heating affects the electromigration behavior of solder …
Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration
Migration of Cu atoms from the cathode side to the anode side causes void formation in the
solder joint, which is the root cause of electromigration failures in lead-free solder joints. This …
solder joint, which is the root cause of electromigration failures in lead-free solder joints. This …