Sn-based lead-free solder has been widely applied in areas like electronic packaging due to
its excellent solderability. The composite solders can be obtained by mixing additional …

In the electronics industry, graphene is applied with modified lead-free solder. This review
presents advances in the preparation, strengthening mechanisms, and property …

The development of hybrid solder for chip packing is a major 3D packaging research topic.
The incorporation of with low melting points into solder materials has been used in low …

In this paper, various mass fractions (0, 0.1, 0.2, 0.4, 0.6, 0.8 wt%) of Mg particles were
added to the Sn58Bi solder to achieve the purpose of modification, through which the Ni …

Due to the miniaturization of electronic devices, electromigration became one of the serious
reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an …

A new type of lead-free composite solder has been prepared by adding Mo nanoparticles in
Sn3. 0Ag0. 5Cu solder. Tensile strength tests were conducted on Sn3. 0Ag0. 5Cu/Cu joint …

Downscaling of electronic devices increased the current density in the solder joint. High
current density causes the rapid diffusion of Cu atoms which is the root cause of failure in …

Abstract Eutectic Sn–Bi alloy is acquiring significant observation in the electronic packaging
industry because of its advantageous properties such as ductility, low melting temperature …

Electromigration is one of the most important research issues affecting the reliability of
solder joints. Current-induced Joule heating affects the electromigration behavior of solder …

Migration of Cu atoms from the cathode side to the anode side causes void formation in the
solder joint, which is the root cause of electromigration failures in lead-free solder joints. This …