In this review, a review a of the applications of micro-Raman spectroscopy (μRS) to
characterize the residual strain and/or stress in electronic packaging is presented. Micro …

Piezoresistive sensors are among the earliest micromachined silicon devices. The need for
smaller, less expensive, higher performance sensors helped drive early micromachining …

Structural reliability of integrated circuit (IC) chips in electronic packages continues to be a
major concern due to ever-increasing die size, circuit densities, power dissipation, operating …

A promising approach for detecting biomolecules follows their binding to immobilized probe
molecules on microfabricated cantilevers; binding causes surface stresses that bend the …

This paper demonstrates that the intrinsic piezoresistive response of the MOSFET channel is
independent of length. The reported fall-off of the piezoresistive response of the transistor in …

Three-dimensional integrated circuit (3D IC) with through-silicon-via (TSV) is believed to
offer new levels of efficiency, power, performance, and form-factor advantages over the …

The ongoing research on and development of increasingly intelligent artificial systems
propels the need for bio inspired pressure sensitive spiking circuits. Here we present an …

Piezoresistive sensors are among the oldest and most widely used silicon microsystems. Yet
a book dedicated to their design is strangely lacking and most introductory MEMS textbooks …

Strain engineering is a widely used technique for enhancing the mobility of charge carriers
in semiconductors, but its effect is not fully understood. In this work, we perform first …

The field of piezoresistance has mainly advanced through experimental research; however,
the improved accuracy of simulations and the emergence of new materials have increased …