Analysis and optimization of sidewall roughness on microwave performance of through-glass vias in 3-D integrated circuits

Z Fang, J Zhang, J Liu, H Chen, L Gao… - IEEE Transactions …, 2023 - ieeexplore.ieee.org
The integrity and reliability of signal transmission in glass 3-D integrated circuits (ICs) can be
improved by studying the effect of sidewall roughness of through-glass vias (TGVs) on …

Chip-to-chip copper interconnects with rough surfaces: analytical models for parameter extraction and performance evaluation

S Kumar, R Sharma - IEEE Transactions on Components …, 2017 - ieeexplore.ieee.org
In multigigahertz integrated circuit design, the extra delay and power losses due to surface
roughness in copper (Cu) interconnects is more evident than ever before and needs utmost …

Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits

Z Fang, J Zhang, J Liu, J Fu, S Li, X Cai… - … on Electron Devices, 2024 - ieeexplore.ieee.org
In glass-based 3-D integrated circuits (ICs), nonuniform through-glass vias (TGVs) contribute
to increased delay, higher losses, and performance degradation, particularly notable in …

Design of energy-aware interconnects for next generation micro systems

R Sharma, S Kumar - CSI Transactions on ICT, 2019 - Springer
This paper presents an overview of the problem of surface roughness in ultra-scaled Copper
(Cu) interconnects. It is seen that surface roughness can severely degrade the electrical and …

Investigating the role of sidewall surface roughness on the performance of through silicon vias

S Kumar, S Pathania, R Sharma - 2017 IEEE 19th Electronics …, 2017 - ieeexplore.ieee.org
In this paper, we present the effect of sidewall roughness, formed by Bosch etching, on the
performance of TSVs for frequencies up to 100GHz. Industry standard EM solvers, Ansys …

Performance modeling and broadband characterization of chip-to-chip interconnects with rough surfaces

S Kumar, R Sharma - 2016 IEEE 18th electronics packaging …, 2016 - ieeexplore.ieee.org
Planar copper interconnects suffer from surface roughness that results in their performance
degradation. In this paper, we investigate the role of rough conductor surfaces on the …