Analysis and optimization of sidewall roughness on microwave performance of through-glass vias in 3-D integrated circuits
Z Fang, J Zhang, J Liu, H Chen, L Gao… - IEEE Transactions …, 2023 - ieeexplore.ieee.org
The integrity and reliability of signal transmission in glass 3-D integrated circuits (ICs) can be
improved by studying the effect of sidewall roughness of through-glass vias (TGVs) on …
improved by studying the effect of sidewall roughness of through-glass vias (TGVs) on …
Chip-to-chip copper interconnects with rough surfaces: analytical models for parameter extraction and performance evaluation
In multigigahertz integrated circuit design, the extra delay and power losses due to surface
roughness in copper (Cu) interconnects is more evident than ever before and needs utmost …
roughness in copper (Cu) interconnects is more evident than ever before and needs utmost …
Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits
Z Fang, J Zhang, J Liu, J Fu, S Li, X Cai… - … on Electron Devices, 2024 - ieeexplore.ieee.org
In glass-based 3-D integrated circuits (ICs), nonuniform through-glass vias (TGVs) contribute
to increased delay, higher losses, and performance degradation, particularly notable in …
to increased delay, higher losses, and performance degradation, particularly notable in …
Design of energy-aware interconnects for next generation micro systems
This paper presents an overview of the problem of surface roughness in ultra-scaled Copper
(Cu) interconnects. It is seen that surface roughness can severely degrade the electrical and …
(Cu) interconnects. It is seen that surface roughness can severely degrade the electrical and …
Investigating the role of sidewall surface roughness on the performance of through silicon vias
S Kumar, S Pathania, R Sharma - 2017 IEEE 19th Electronics …, 2017 - ieeexplore.ieee.org
In this paper, we present the effect of sidewall roughness, formed by Bosch etching, on the
performance of TSVs for frequencies up to 100GHz. Industry standard EM solvers, Ansys …
performance of TSVs for frequencies up to 100GHz. Industry standard EM solvers, Ansys …
Performance modeling and broadband characterization of chip-to-chip interconnects with rough surfaces
Planar copper interconnects suffer from surface roughness that results in their performance
degradation. In this paper, we investigate the role of rough conductor surfaces on the …
degradation. In this paper, we investigate the role of rough conductor surfaces on the …