Polyoxometalates (POMs) are widely used in catalysis, energy storage, biomedicine, and
other research fields due to their unique acidity, photothermal, and redox features. However …

This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …

To facilitate the development of thermoelectric modules for various operating temperature
ranges, a connection technology that is suitable for heat-sensitive thermoelectric materials …

As one of the promising packaging materials, the paste of silver nanoparticles (AgNPs)
reinforced by SiC particles is investigated in this study for microstructure, thermal stability …

There has been a significant rise in the number of research papers on silver nanoparticle
based solutions for harsh environment die attach. However, sintering nanoparticles is a …

The growing demand toward miniaturization and power device packaging required new die‐
attach materials with high thermal conductivity (TC). Multitudinous attention is being paid to …

Sintered Ag joint is a potential Pb-free die attach materials for power electronics because of
its high operating temperature, high electrical and thermal conductivity as well as its thermo …

Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part
of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill …

Ag sinter joining technology has been used in the advanced power applications to replace
conventional soldering technology due to its high temperature stability, along with its …

Silver sintering is a promising die attach technology to ensure high thermal reliability. The
long-term reliability of SiC device sintered by nano-Ag paste has been evaluated by the high …